Hyosang LEE

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Tigard, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20130284604
- Publication date Oct 31, 2013
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BY-PRODUCT MITIGATION IN THROUGH-SILICON-VIA PLATING
- Publication number 20120064462
- Publication date Mar 15, 2012
- Mark J. WILLEY
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR