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Hyoung II Kim
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Folsom, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die over mold stacked semiconductor package
Patent number
11,948,917
Issue date
Apr 2, 2024
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
11,830,848
Issue date
Nov 28, 2023
Intel Corporation
Zhicheng Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die, vertical-wire package-in-package apparatus, and methods...
Patent number
11,749,653
Issue date
Sep 5, 2023
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Active package substrate having anisotropic conductive layer
Patent number
11,694,987
Issue date
Jul 4, 2023
Intel Corporation
Juan Eduardo Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temporary interconnect for use in testing a semiconductor package
Patent number
11,658,079
Issue date
May 23, 2023
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film (ACF) for use in testing semiconductor...
Patent number
11,637,045
Issue date
Apr 25, 2023
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diode for use in testing semiconductor packages
Patent number
11,545,464
Issue date
Jan 3, 2023
Intel Corporation
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with glass spacer
Patent number
11,393,788
Issue date
Jul 19, 2022
Intel Corporation
Mao Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe in packages of integrated circuits
Patent number
11,251,111
Issue date
Feb 15, 2022
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer for electrically connecting stacked integrated circuit d...
Patent number
11,211,314
Issue date
Dec 28, 2021
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density die package configuration on system boards
Patent number
11,145,632
Issue date
Oct 12, 2021
Intel Corporation
Juan E. Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-stacked die package with flexible interconnect
Patent number
10,892,248
Issue date
Jan 12, 2021
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
Patent number
10,847,450
Issue date
Nov 24, 2020
Intel Corporation
Saeed Shojaie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Active package substrate having anisotropic conductive layer
Patent number
10,790,257
Issue date
Sep 29, 2020
Intel Corporation
Juan Eduardo Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical modulator-based transmission control
Patent number
10,790,910
Issue date
Sep 29, 2020
Intel Corporation
Hyoung-Jun Kim
G02 - OPTICS
Information
Patent Grant
Substrate-free system in package design
Patent number
10,777,486
Issue date
Sep 15, 2020
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package with integrated passive electronics method and a...
Patent number
10,727,220
Issue date
Jul 28, 2020
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with thermal fins
Patent number
10,573,575
Issue date
Feb 25, 2020
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid die stacking
Patent number
10,497,669
Issue date
Dec 3, 2019
Intel Corporation
Juan Eduardo Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package with integrated passive electronics method and a...
Patent number
10,446,533
Issue date
Oct 15, 2019
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
10,393,799
Issue date
Aug 27, 2019
Intel Corporation
Hyoung Il Kim
G01 - MEASURING TESTING
Information
Patent Grant
Multi-package integrated circuit assembly with package on package i...
Patent number
10,181,456
Issue date
Jan 15, 2019
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-package integrated circuit assembly with through-mold via
Patent number
10,134,716
Issue date
Nov 20, 2018
Intel Corporatin
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive stress-relief washers in microelectronic assemblies
Patent number
10,120,424
Issue date
Nov 6, 2018
Intel Corporation
Hyoung Il Kim
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
Publication number
20220254757
Publication date
Aug 11, 2022
Intel Corporation
Mao Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS...
Publication number
20210288034
Publication date
Sep 16, 2021
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
Publication number
20210280558
Publication date
Sep 9, 2021
Intel Corporation
Mao Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20210265305
Publication date
Aug 26, 2021
Intel Corporation
Zhicheng Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE PACKAGE SUBSTRATE HAVING ANISOTROPIC CONDUCTIVE LAYER
Publication number
20200388587
Publication date
Dec 10, 2020
Intel Corporation
Juan Eduardo DOMINGUEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY DIE PACKAGE CONFIGURATION ON SYSTEM BOARDS
Publication number
20200381406
Publication date
Dec 3, 2020
Intel Corporation
Juan E. DOMINGUEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE OVER MOLD STACKED SEMICONDUCTOR PACKAGE
Publication number
20200343221
Publication date
Oct 29, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF) FOR USE IN TESTING SEMICONDUCTOR...
Publication number
20200243405
Publication date
Jul 30, 2020
Intel Corporation
HYOUNG IL KIM
G01 - MEASURING TESTING
Information
Patent Application
LEADFRAME IN PACKAGES OF INTEGRATED CIRCUITS
Publication number
20200235044
Publication date
Jul 23, 2020
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPORARY INTERCONNECT FOR USE IN TESTING A SEMICONDUCTOR PACKAGE
Publication number
20200235018
Publication date
Jul 23, 2020
Intel Corporation
Hyoung Il KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST PROBE FOR WAFER-LEVEL AND PANEL-LEVEL TESTING
Publication number
20200233033
Publication date
Jul 23, 2020
Intel Corporation
Hyoung Il KIM
G01 - MEASURING TESTING
Information
Patent Application
DUAL RDL STACKED DIE PACKAGE USING VERTICAL WIRE
Publication number
20200227386
Publication date
Jul 16, 2020
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES
Publication number
20200227393
Publication date
Jul 16, 2020
Intel Corporation
Hyoung Il KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIODE FOR USE IN TESTING SEMICONDUCTOR PACKAGES
Publication number
20200212009
Publication date
Jul 2, 2020
Intel Corporation
Yi XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE ASSEMBLY
Publication number
20200203326
Publication date
Jun 25, 2020
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER FOR ELECTRICALLY CONNECTING STACKED INTEGRATED CIRCUIT D...
Publication number
20200152558
Publication date
May 14, 2020
Intel Corporation
HYOUNG IL KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20200075446
Publication date
Mar 5, 2020
Intel Corporation
Juan E. Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE PACKAGE SUBSTRATE HAVING ANISOTROPIC CONDUCTIVE LAYER
Publication number
20200066670
Publication date
Feb 27, 2020
Intel Corporation
Juan Eduardo DOMINGUEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE WITH INTEGRATED PASSIVE ELECTRONICS METHOD AND A...
Publication number
20190355709
Publication date
Nov 21, 2019
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-STACKED DIE PACKAGE WITH FLEXIBLE INTERCONNECT
Publication number
20190333895
Publication date
Oct 31, 2019
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20190229093
Publication date
Jul 25, 2019
Intel Corporation
Juan E. Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPACT WIREBONDING IN STACKED-CHIP SYSTEM IN PACKAGE, AND METHODS...
Publication number
20190181072
Publication date
Jun 13, 2019
Saeed SHOJAIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE PACKAGE SUBSTRATE HAVING EMBEDDED INTERPOSER
Publication number
20190181093
Publication date
Jun 13, 2019
Intel Corporation
Juan Eduardo DOMINGUEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL MODULATOR-BASED TRANSMISSION CONTROL
Publication number
20190149241
Publication date
May 16, 2019
Intel Corporation
Hyoung-Jun Kim
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20190101583
Publication date
Apr 4, 2019
Intel Corporation
HYOUNG IL KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE ON PACKAGE WITH INTEGRATED PASSIVE ELECTRONICS METHOD AND A...
Publication number
20190103388
Publication date
Apr 4, 2019
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL FINS
Publication number
20190067156
Publication date
Feb 28, 2019
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE-FREE SYSTEM IN PACKAGE DESIGN
Publication number
20190051582
Publication date
Feb 14, 2019
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-PACKAGE INTEGRATED CIRCUIT ASSEMBLY WITH THROUGH-MOLD VIA
Publication number
20180269187
Publication date
Sep 20, 2018
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-PACKAGE INTEGRATED CIRCUIT ASSEMBLY WITH PACKAGE ON PACKAGE I...
Publication number
20180269183
Publication date
Sep 20, 2018
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS