Hyuck-Jin Kang

Person

Seoul-City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus and controlling method thereof
- Patent number 12,010,363
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Junhyung Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fuse region of a semiconductor region
- Patent number 7,352,050
- Issue date Apr 1, 2008
- Samsung Electronics Co., Ltd.
- Hyuck-Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices having corrosion resistant fuse regions...
- Patent number 7,180,154
- Issue date Feb 20, 2007
- Samsung Electronics Co., Ltd.
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure of a semiconductor device
- Patent number 6,984,895
- Issue date Jan 10, 2006
- Samsung Electronics Co., Ltd.
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure of a semiconductor device and method for manu...
- Patent number 6,867,070
- Issue date Mar 15, 2005
- Samsung Electronics Co., Ltd.
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20230225111
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Dong Hwan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF
- Publication number 20230179812
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Junhyung PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Character input apparatus and method of portable terminal
- Publication number 20070210939
- Publication date Sep 13, 2007
- Samsung Electronics Co., Ltd.
- Hyuck-In Kang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated circuit devices having corrosion resistant fuse regions...
- Publication number 20070114635
- Publication date May 24, 2007
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fuse region of a semiconductor device and method of fabricating the...
- Publication number 20050212081
- Publication date Sep 29, 2005
- Hyuck-Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit devices having corrosion resistant fuse regions...
- Publication number 20040262768
- Publication date Dec 30, 2004
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure of a semiconductor device and method for manu...
- Publication number 20030136979
- Publication date Jul 24, 2003
- Samsung Electronics Co., Ltd.
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure of a semiconductor device and method for manu...
- Publication number 20030094634
- Publication date May 22, 2003
- Tai-Heui Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a contact window and fabrication method...
- Publication number 20030008453
- Publication date Jan 9, 2003
- Samsung Electronics Co., Ltd.
- Hyuck-Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS

Hyuck-Jin Kang

Person

Patents Grantslast 30 patents

Electronic apparatus and controlling method thereof

Fuse region of a semiconductor region

Integrated circuit devices having corrosion resistant fuse regions...

Bonding pad structure of a semiconductor device

Bonding pad structure of a semiconductor device and method for manu...

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME

ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF

Character input apparatus and method of portable terminal

Integrated circuit devices having corrosion resistant fuse regions...

Fuse region of a semiconductor device and method of fabricating the...

Integrated circuit devices having corrosion resistant fuse regions...

Bonding pad structure of a semiconductor device and method for manu...

Bonding pad structure of a semiconductor device and method for manu...

Semiconductor device having a contact window and fabrication method...