Hyuekjae Lee

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,261,164
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip having BS-PDN structure
- Patent number 11,984,421
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,336
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,798,929
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill material layer and method...
- Patent number 11,764,192
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 11,721,673
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a pad contacting a via
- Patent number 11,694,996
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved reliability in bonds between...
- Patent number 11,676,925
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,658,141
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 11,658,148
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 11,552,033
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,527,509
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,508,685
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill material layer and method...
- Patent number 11,404,395
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,289,438
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 11,244,927
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved reliability in bonds between...
- Patent number 11,158,594
- Issue date Oct 26, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer level package and semiconductor device fabricated...
- Patent number 8,558,371
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive vias, conductive caps...
- Patent number 8,399,987
- Issue date Mar 19, 2013
- Samsung Electronics Co., Ltd.
- Woonseong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183194
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Jingyu BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20250015026
- Publication date Jan 9, 2025
- Samsung Electronics Co., LTD
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404970
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240258278
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Hyungchul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234374
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234349
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136311
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136329
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096831
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Enbin Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240071995
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Raeyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072003
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES
- Publication number 20240055372
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030214
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030074
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317654
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jihoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20230253363
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20230163088
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230113465
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20230076511
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- JIHWAN SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
- Publication number 20220344308
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220208649
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Seungyeol Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...
- Publication number 20220181285
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165722
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE
- Publication number 20220139863
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220139880
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220139874
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220130801
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae LEE
- H01 - BASIC ELECTRIC ELEMENTS

Hyuekjae Lee

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor package and a method for manufacturing the same

Integrated circuit chip having BS-PDN structure

Stacked semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package including underfill material layer and method...

Semiconductor package having stacked semiconductor chips

Semiconductor package including a pad contacting a via

Semiconductor packages having improved reliability in bonds between...

Die-to-wafer bonding structure and semiconductor package using the...

Semiconductor package and a method for manufacturing the same

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor package

Stacked semiconductor package

Semiconductor package including underfill material layer and method...

Die-to-wafer bonding structure and semiconductor package using the...

Semiconductor package having stacked semiconductor chips

Semiconductor packages having improved reliability in bonds between...

Method for wafer level package and semiconductor device fabricated...

Microelectronic devices including conductive vias, conductive caps...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS