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Hyun-Joon Oh
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Austin, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding tool for mounting semiconductor chips
Patent number
7,958,628
Issue date
Jun 14, 2011
STATS ChipPAC, Ltd.
Hee-Bong Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding tool for mounting semiconductor chips
Patent number
7,650,688
Issue date
Jan 26, 2010
ChipPAC, Inc.
Hee-Bong Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor chip packaging method with individually placed film a...
Patent number
7,306,971
Issue date
Dec 11, 2007
Chippac Inc.
Jin-Wook Jeong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Bonding Tool for Mounting Semiconductor Chips
Publication number
20100083494
Publication date
Apr 8, 2010
ChipPAC, Inc.
Hee-Bong Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding tool for mounting semiconductor chips
Publication number
20050221582
Publication date
Oct 6, 2005
ChipPAC, Inc.
Hee-Bong Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor chip packaging method with individually placed film a...
Publication number
20050208701
Publication date
Sep 22, 2005
ChipPAC, Inc.
Jin-Wook Jeong
H01 - BASIC ELECTRIC ELEMENTS