Hyun Joung Kim

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Namyangju, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with offset stack
- Patent number 8,659,175
- Issue date Feb 25, 2014
- Stats Chippac Ltd.
- Jong Wook Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including honeycomb molding
- Patent number 8,217,501
- Issue date Jul 10, 2012
- Stats Chippac Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including honeycomb molding
- Patent number 7,737,539
- Issue date Jun 15, 2010
- Stats Chippac Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-on-package system with central bond wires
- Patent number 7,687,920
- Issue date Mar 30, 2010
- Stats Chippac Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with thermo-mechanical interlocki...
- Patent number 7,656,017
- Issue date Feb 2, 2010
- Stats Chippac Ltd.
- Hyun Joung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked integrated circuit package system with connection protection
- Patent number 7,443,037
- Issue date Oct 28, 2008
- Stats Chippac Ltd.
- Hyun Joung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
- Publication number 20100237488
- Publication date Sep 23, 2010
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH CENTRAL BOND WIRES
- Publication number 20090256267
- Publication date Oct 15, 2009
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THERMO-MECHANICAL INTERLOCKI...
- Publication number 20080142943
- Publication date Jun 19, 2008
- Hyun Joung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACK
- Publication number 20070296086
- Publication date Dec 27, 2007
- Jong Wook Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONNECTION PROTECTION
- Publication number 20070229107
- Publication date Oct 4, 2007
- STATS ChipPAC Ltd.
- Hyun Joung Kim
- H01 - BASIC ELECTRIC ELEMENTS