Hyun Jung Lee

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Aliso Viejo, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with corner pins
- Patent number 9,142,491
- Issue date Sep 22, 2015
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with reduced solder voiding
- Patent number 9,029,991
- Issue date May 12, 2015
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of tamper proof packaging of a semiconductor de...
- Patent number 8,455,990
- Issue date Jun 4, 2013
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Corner Pins
- Publication number 20140091448
- Publication date Apr 3, 2014
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Sphere Array Package
- Publication number 20130256885
- Publication date Oct 3, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Stud Bump Wafer Level Package
- Publication number 20130087915
- Publication date Apr 11, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages with reduced solder voiding
- Publication number 20120119341
- Publication date May 17, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods of Tamper Proof Packaging of a Semiconductor De...
- Publication number 20100213590
- Publication date Aug 26, 2010
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS