Hyun Kyu Im

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Busan, KR

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Patents Grantslast 30 patents

Information Patent Grant
Stacked chip device and manufacturing method thereof
- Patent number 8,675,342
- Issue date Mar 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Beom Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COIL ELECTRONIC COMPONENT
- Publication number 20250037929
- Publication date Jan 30, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seungho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230132788
- Publication date May 4, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Kyu IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120320496
- Publication date Dec 20, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jong Beom Shin
- H01 - BASIC ELECTRIC ELEMENTS