Hyun Mo Ku

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Thermal dissipation and shielding improvement using merged PCB bott...
- Patent number 11,723,143
- Issue date Aug 8, 2023
- Avago Technologies International Sales Pte. Limited
- Chang Kyu Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having a solder-on-pad structure
- Patent number 9,972,590
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Deog Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped land grid array
- Patent number 9,972,592
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with external shield and back-spill barrier for protecting c...
- Patent number 9,974,181
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board (PCB) and PCB assembly having an encapsulatin...
- Patent number 9,907,169
- Issue date Feb 27, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with thermal via
- Patent number 9,693,445
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD (PCB) AND PCB ASSEMBLY HAVING AN ENCAPSULATIN...
- Publication number 20180063951
- Publication date Mar 1, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH THERMAL VIA
- Publication number 20160227641
- Publication date Aug 4, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
- Publication number 20160204077
- Publication date Jul 14, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS