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Hyun Sik CHAE

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  • Suwon-si, KR
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Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20250029786
    • Publication date Jan 23, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Yong PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240379292
    • Publication date Nov 14, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyun Sik Chae
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240249882
    • Publication date Jul 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hye Yun JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240222010
    • Publication date Jul 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Eun Jung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240203661
    • Publication date Jun 20, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sim Chung KANG
    • H01 - BASIC ELECTRIC ELEMENTS