Hyun Uk Kim

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming shallow trench isolation
- Patent number 6,277,710
- Issue date Aug 21, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Hyun Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
- Publication number 20070158806
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE SYSTEM
- Publication number 20060180914
- Publication date Aug 17, 2006
- STATS ChipPAC Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS