Hyundong LEE

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250008749
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Hyundong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...
- Publication number 20240297122
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Hyundong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038740
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Hyundong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230142301
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Changbo LEE
- H01 - BASIC ELECTRIC ELEMENTS