Hyung Jun Jeon

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM
- Publication number 20070176285
- Publication date Aug 2, 2007
- STATS ChipPAC Ltd.
- Hyung Jun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP FOR OVERHANG DEVICE
- Publication number 20070001296
- Publication date Jan 4, 2007
- STATS ChipPAC Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS