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Hyung Jun Jeon
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Singapore, SG
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last 30 patents
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Patent Application
INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM
Publication number
20070176285
Publication date
Aug 2, 2007
STATS ChipPAC Ltd.
Hyung Jun Jeon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BUMP FOR OVERHANG DEVICE
Publication number
20070001296
Publication date
Jan 4, 2007
STATS ChipPAC Ltd.
Hun Teak Lee
H01 - BASIC ELECTRIC ELEMENTS