Hyung-Lae Eun

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Seongnam-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package having a stacked plurality of different sized se...
- Patent number 9,397,034
- Issue date Jul 19, 2016
- Samsung Electronics Co., Ltd.
- Hyung-Iae Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having a stacked plurality of different sized se...
- Patent number 8,395,259
- Issue date Mar 12, 2013
- Samsung Electronics Co., Ltd.
- Hyung-Iae Eun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE HAVING A STACKED PLURALITY OF DIFFERENT SIZED SE...
- Publication number 20160300819
- Publication date Oct 13, 2016
- Hyung-Lae Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE HAVING A STACKED PLURALITY OF DIFFERENT SIZED SE...
- Publication number 20130147044
- Publication date Jun 13, 2013
- Hyung-lae EUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Structure of Semiconductor Packages Including Through-Silic...
- Publication number 20110127679
- Publication date Jun 2, 2011
- Hyung-Lae Eun
- H01 - BASIC ELECTRIC ELEMENTS