Hyungjun Jeon

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of manufacturing the semiconduct...
- Patent number 12,300,671
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,775
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages stacked by wafer bonding process and methods...
- Patent number 11,810,900
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,419
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 11,749,586
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,721,562
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,694,980
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,315,894
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacture using the...
- Patent number 10,651,074
- Issue date May 12, 2020
- Samsung Electronics Co., Ltd.
- Kyoung Hwan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 9,922,897
- Issue date Mar 20, 2018
- Samsung Electronics Co., Ltd.
- Kyoung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and method of fabricating semiconductor device using the same
- Patent number 9,496,163
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- HyungJun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid compositions and methods of fabricating a semiconductor devi...
- Patent number 9,399,822
- Issue date Jul 26, 2016
- Samsung Electronics Co., Ltd.
- Dong-Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157983
- Publication date May 15, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038149
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234251
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240153851
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240047305
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Seungha OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240038732
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20230361004
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230335415
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178533
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...
- Publication number 20220406740
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Taeyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND SEMICONDUCTOR...
- Publication number 20220367321
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220359348
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20220310485
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220223555
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220037235
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Hakseung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20220013503
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210305186
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210143026
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURE USING THE...
- Publication number 20180114714
- Publication date Apr 26, 2018
- Samsung Electronics Co., Ltd.
- KYOUNG HWAN KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20180076108
- Publication date Mar 15, 2018
- Kyoung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20150162235
- Publication date Jun 11, 2015
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVI...
- Publication number 20150079782
- Publication date Mar 19, 2015
- Samsung Electronics Co., Ltd.
- Dong-Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hyungjun Jeon

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of manufacturing the semiconduct...

Semiconductor device including through via structure

Semiconductor device

Semiconductor packages stacked by wafer bonding process and methods...

Semiconductor device

Semiconductor device including through via structure

Substrate bonding apparatus

Semiconductor stack and method for manufacturing the same

Semiconductor stack and method for manufacturing the same

Substrate processing apparatus and method of manufacture using the...

Method of manufacturing semiconductor package

Carrier and method of fabricating semiconductor device using the same

Liquid compositions and methods of fabricating a semiconductor devi...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURE USING THE...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

LIQUID COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVI...