HYUNGLAK MA

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device
- Patent number 11,367,714
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Jangwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429110
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A PACKAGE SUBSTRATE AND METHOD FOR MA...
- Publication number 20230110126
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JEONGHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210043612
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- JANGWOO LEE
- H01 - BASIC ELECTRIC ELEMENTS