HyungMin Lee

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method for controlling application thereof
- Patent number 12,033,252
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Hanchul Jung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming 3D semiconductor package...
- Patent number 9,391,046
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Yeonglm Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of mounting semiconductor die to o...
- Patent number 9,305,897
- Issue date Apr 5, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming a stackable semiconducto...
- Patent number 9,190,297
- Issue date Nov 17, 2015
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming prefabricated multi-die...
- Patent number 9,153,476
- Issue date Oct 6, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with an integral-interposer-str...
- Patent number 8,710,634
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with laser hole and method of m...
- Patent number 8,710,668
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- HyungMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of mounting semiconductor die to o...
- Patent number 8,648,469
- Issue date Feb 11, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with a stack package and method...
- Patent number 8,426,955
- Issue date Apr 23, 2013
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming prefabricated multi-die...
- Patent number 8,357,564
- Issue date Jan 22, 2013
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of mounting semiconductor die to o...
- Patent number 8,008,121
- Issue date Aug 30, 2011
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR CONTROLLING APPLICATION THEREOF
- Publication number 20220180582
- Publication date Jun 9, 2022
- Samsung Electronics Co., LTD
- Hanchul JUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package and Method of Mounting Semiconductor Die to O...
- Publication number 20140110860
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Prefabricated Multi-Die...
- Publication number 20130087898
- Publication date Apr 11, 2013
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20130075923
- Publication date Mar 28, 2013
- YeongIm Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Stackable Semiconducto...
- Publication number 20130037936
- Publication date Feb 14, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...
- Publication number 20120326324
- Publication date Dec 27, 2012
- HyungMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LASER HOLE AND METHOD OF M...
- Publication number 20120319294
- Publication date Dec 20, 2012
- HyungMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming 3D Semiconductor Package...
- Publication number 20120292745
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- YeongIm Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Mounting Semiconductor Die to O...
- Publication number 20110278721
- Publication date Nov 17, 2011
- STATS ChipPAC, Ltd.
- DaeSi Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Prefabricated Multi-Die...
- Publication number 20110278707
- Publication date Nov 17, 2011
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Method of Mounting Semiconductor Die to O...
- Publication number 20110101512
- Publication date May 5, 2011
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACK PACKAGE AND METHOD...
- Publication number 20100314738
- Publication date Dec 16, 2010
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STR...
- Publication number 20100244222
- Publication date Sep 30, 2010
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS

HyungMin Lee

Person

Patents Grantslast 30 patents

Electronic device and method for controlling application thereof

Semiconductor device and method of forming 3D semiconductor package...

Semiconductor package and method of mounting semiconductor die to o...

Semiconductor device and method of forming a stackable semiconducto...

Semiconductor device and method of forming prefabricated multi-die...

Integrated circuit packaging system with an integral-interposer-str...

Integrated circuit packaging system with laser hole and method of m...

Semiconductor package and method of mounting semiconductor die to o...

Integrated circuit packaging system with a stack package and method...

Semiconductor device and method of forming prefabricated multi-die...

Semiconductor package and method of mounting semiconductor die to o...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD FOR CONTROLLING APPLICATION THEREOF

Semiconductor Package and Method of Mounting Semiconductor Die to O...

Semiconductor Device and Method of Forming Prefabricated Multi-Die...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

Semiconductor Device and Method of Forming a Stackable Semiconducto...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LASER HOLE AND METHOD OF M...

Semiconductor Device and Method of Forming 3D Semiconductor Package...

Semiconductor Package and Method of Mounting Semiconductor Die to O...

Semiconductor Device and Method of Forming Prefabricated Multi-Die...

Semiconductor Package and Method of Mounting Semiconductor Die to O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACK PACKAGE AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STR...