HyungSang Park

Person

Hanam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming substrate including embe...
- Patent number 10,665,662
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming substrate including embe...
- Patent number 10,236,337
- Issue date Mar 19, 2019
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming substrate including embe...
- Patent number 9,837,484
- Issue date Dec 5, 2017
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming POP with stacked semicon...
- Patent number 9,324,659
- Issue date Apr 26, 2016
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of support system with fine pitch
- Patent number 9,210,816
- Issue date Dec 8, 2015
- Stats Chippac Ltd.
- YoungDal Roh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with package-on-package stackin...
- Patent number 8,592,973
- Issue date Nov 26, 2013
- Stats Chippac Ltd.
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulation and method o...
- Patent number 8,569,869
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shield and method of manuf...
- Patent number 8,314,486
- Issue date Nov 20, 2012
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system
- Patent number 8,102,666
- Issue date Jan 24, 2012
- Stats Chippac Ltd.
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having through silicon via with...
- Patent number 8,093,100
- Issue date Jan 10, 2012
- Stats Chippac Ltd.
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having through silicon via with...
- Patent number 7,859,099
- Issue date Dec 28, 2010
- Stats Chippac Ltd.
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Substrate Including Embe...
- Publication number 20190172902
- Publication date Jun 6, 2019
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Substrate Including Embe...
- Publication number 20180053819
- Publication date Feb 22, 2018
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SINGLE-LAYER SUPPORT STRUC...
- Publication number 20170069565
- Publication date Mar 9, 2017
- STATS ChipPAC Pte Ltd.
- BONG WOO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Substrate Including Embe...
- Publication number 20160351486
- Publication date Dec 1, 2016
- STATS ChipPAC, Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming POP With Stacked Semicon...
- Publication number 20130032952
- Publication date Feb 7, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF...
- Publication number 20120119345
- Publication date May 17, 2012
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20110233736
- Publication date Sep 29, 2011
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELD AND METHOD OF MANUF...
- Publication number 20110204494
- Publication date Aug 25, 2011
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE STACKIN...
- Publication number 20110089552
- Publication date Apr 21, 2011
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH...
- Publication number 20110062591
- Publication date Mar 17, 2011
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH...
- Publication number 20100148354
- Publication date Jun 17, 2010
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20100046183
- Publication date Feb 25, 2010
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS

HyungSang Park

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming substrate including embe...

Semiconductor device and method of forming substrate including embe...

Semiconductor device and method of forming substrate including embe...

Semiconductor device and method of forming POP with stacked semicon...

Method of manufacture of support system with fine pitch

Integrated circuit packaging system with package-on-package stackin...

Integrated circuit packaging system with encapsulation and method o...

Integrated circuit packaging system with shield and method of manuf...

Integrated circuit package system

Integrated circuit packaging system having through silicon via with...

Integrated circuit packaging system having through silicon via with...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Substrate Including Embe...

Semiconductor Device and Method of Forming Substrate Including Embe...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SINGLE-LAYER SUPPORT STRUC...

Semiconductor Device and Method of Forming Substrate Including Embe...

Semiconductor Device and Method of Forming POP With Stacked Semicon...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELD AND METHOD OF MANUF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE STACKIN...

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH...

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH...

INTEGRATED CIRCUIT PACKAGE SYSTEM