Hyungsuk Alexander Yoon

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Resistive random access memory with preformed filaments
- Patent number 12,127,486
- Issue date Oct 22, 2024
- Lam Research Corporation
- Hyungsuk Yoon
Information Patent Grant
Modifying ferroelectric properties of hafnium oxide with hafnium ni...
- Patent number 11,923,404
- Issue date Mar 5, 2024
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping layer for a hafnium oxide-based ferroelectric material
- Patent number 11,923,189
- Issue date Mar 5, 2024
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of sealing open pores on surface of porous dielectric materi...
- Patent number 10,535,514
- Issue date Jan 14, 2020
- Korea Advanced Institute of Science and Technology
- Byung Jin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming germanium and silicon germanium nanowire devices
- Patent number 9,911,660
- Issue date Mar 6, 2018
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing n-doped graphene and electrical component u...
- Patent number 9,472,675
- Issue date Oct 18, 2016
- Korea Advanced Institute of Science and Technology
- Byung Jin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 9,359,673
- Issue date Jun 7, 2016
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the removal of a fluorinated polymer from a substrate
- Patent number 8,926,789
- Issue date Jan 6, 2015
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- B08 - CLEANING
Information Patent Grant
Method for barrier interface preparation of copper interconnect
- Patent number 8,916,232
- Issue date Dec 23, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for removing a metal oxide from a substrate
- Patent number 8,883,027
- Issue date Nov 11, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect with self-formed barrier
- Patent number 8,673,779
- Issue date Mar 18, 2014
- Lam Research Corporation
- Hyungsuk A. Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for three dimensional integrated circuits
- Patent number 8,673,769
- Issue date Mar 18, 2014
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for atomic layer deposition
- Patent number 8,623,456
- Issue date Jan 7, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device with post-contact back end of line through-hole via integration
- Patent number 8,519,461
- Issue date Aug 27, 2013
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for three-dimensional integrated circuit throug...
- Patent number 8,323,460
- Issue date Dec 4, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing an edge polymer from a substrate
- Patent number 8,298,433
- Issue date Oct 30, 2012
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 8,287,647
- Issue date Oct 16, 2012
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a barrier surface for copper...
- Patent number 8,241,701
- Issue date Aug 14, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of post-contact back end of line through-hole via integration
- Patent number 8,187,968
- Issue date May 29, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for isolated bevel edge clean and method for using the same
- Patent number 8,127,395
- Issue date Mar 6, 2012
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of fabricating electronic devices using direct copper plating
- Patent number 8,058,164
- Issue date Nov 15, 2011
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for low interfacial oxide contact between barri...
- Patent number 8,053,355
- Issue date Nov 8, 2011
- Lam Research Corporation
- Fritz Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and method of manufacturing a damascene stru...
- Patent number 8,026,605
- Issue date Sep 27, 2011
- Lam Research Corporation
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a barrier layer with varying composition for...
- Patent number 7,863,179
- Issue date Jan 4, 2011
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for low interfacial oxide contact between barri...
- Patent number 7,749,893
- Issue date Jul 6, 2010
- Lam Research Corporation
- Fritz Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for the removal of a fluorinated polymer from a substrate...
- Patent number 7,691,278
- Issue date Apr 6, 2010
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- B08 - CLEANING
Information Patent Grant
Apparatus for the removal of a metal oxide from a substrate and met...
- Patent number 7,662,253
- Issue date Feb 16, 2010
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for the removal of an edge polymer from a substrate and m...
- Patent number 7,651,585
- Issue date Jan 26, 2010
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of post-contact back end of the line through-hole via integ...
- Patent number 7,615,480
- Issue date Nov 10, 2009
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESISTIVE RANDOM ACCESS MEMORY WITH PREFORMED FILAMENTS
- Publication number 20220069218
- Publication date Mar 3, 2022
- LAM RESEARCH CORPORATION
- Hyungsuk YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING FERROELECTRIC PROPERTIES OF HAFNIUM OXIDE WITH HAFNIUM NI...
- Publication number 20210028273
- Publication date Jan 28, 2021
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander YOON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPPING LAYER FOR A HAFNIUM OXIDE-BASED FERROELECTRIC MATERIAL
- Publication number 20210020433
- Publication date Jan 21, 2021
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING PERFORMANCE IN HAFNIUM OXIDE-BASED FERROELECT...
- Publication number 20190057860
- Publication date Feb 21, 2019
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Surface Localized Pore Sealing of Porous Dielectric Material
- Publication number 20180277362
- Publication date Sep 27, 2018
- LAM RESEARCH CORPORATION
- Byung Jin Cho
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method of Sealing Open Pores on Surface of Porous Dielectric Materi...
- Publication number 20170358488
- Publication date Dec 14, 2017
- Korea Advanced Institute of Science and Technology
- Byung Jin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING GERMANIUM AND SILICON GERMANIUM NANOWIRE DEVICES
- Publication number 20170309521
- Publication date Oct 26, 2017
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Interconnect Device Including Surface Functionalized Graphen...
- Publication number 20160270237
- Publication date Sep 15, 2016
- LAM RESEARCH CORPORATION
- Byung Jin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FORMING SELECTIVE METAL ELECTRODE LAYERS FO...
- Publication number 20160138166
- Publication date May 19, 2016
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Manufacturing N-Doped Graphene and Electrical Component U...
- Publication number 20150280011
- Publication date Oct 1, 2015
- Korea Advanced Institute of Science and Technology
- Byung Jin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150132946
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150128861
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20140145334
- Publication date May 29, 2014
- John BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...
- Publication number 20130171820
- Publication date Jul 4, 2013
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATOMIC LAYER DEPOSITION
- Publication number 20130040460
- Publication date Feb 14, 2013
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processes and Systems for Engineering a Barrier Surface for Copper...
- Publication number 20120269987
- Publication date Oct 25, 2012
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION
- Publication number 20120248219
- Publication date Oct 4, 2012
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20120205807
- Publication date Aug 16, 2012
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Isolated Bevel Edge Clean
- Publication number 20120118320
- Publication date May 17, 2012
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING ELECTRONIC DEVICES USING DIRECT COPPER PLATING
- Publication number 20120056325
- Publication date Mar 8, 2012
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...
- Publication number 20110306203
- Publication date Dec 15, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURI...
- Publication number 20110143553
- Publication date Jun 16, 2011
- LAM RESEARCH CORPORATION
- Yaxin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Fabricating a Barrier Layer Over Interconnect Structures...
- Publication number 20110065273
- Publication date Mar 17, 2011
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...
- Publication number 20100267229
- Publication date Oct 21, 2010
- Fritz Redeker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR THE REMOVAL OF A FLUORINATED POLYMER FROM A SUBSTRATE
- Publication number 20100181025
- Publication date Jul 22, 2010
- Hyungsuk Alexander Yoon
- B08 - CLEANING
Information Patent Application
METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE
- Publication number 20100108491
- Publication date May 6, 2010
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR REMOVING AN EDGE POLYMER FROM A SUBSTRATE
- Publication number 20100099265
- Publication date Apr 22, 2010
- HYUNGSUK ALEXANDER YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20100044867
- Publication date Feb 25, 2010
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR INTEGRATED SURFACE TREATMENT AND DEPOSITION FOR COPPE...
- Publication number 20090320749
- Publication date Dec 31, 2009
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self assembled monolayer for improving adhesion between copper and...
- Publication number 20090304914
- Publication date Dec 10, 2009
- LAM RESEARCH CORPORATION
- Praveen Nalla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hyungsuk Alexander Yoon

Person

Patents Grantslast 30 patents

Resistive random access memory with preformed filaments

Modifying ferroelectric properties of hafnium oxide with hafnium ni...

Capping layer for a hafnium oxide-based ferroelectric material

Method of sealing open pores on surface of porous dielectric materi...

Methods for forming germanium and silicon germanium nanowire devices

Method of manufacturing n-doped graphene and electrical component u...

Apparatus and method for atomic layer deposition

Controlled ambient system for interface engineering

Apparatus for the removal of a fluorinated polymer from a substrate

Method for barrier interface preparation of copper interconnect

Methods for removing a metal oxide from a substrate

Interconnect with self-formed barrier

Methods and apparatuses for three dimensional integrated circuits

Methods for atomic layer deposition

Device with post-contact back end of line through-hole via integration

Methods and systems for three-dimensional integrated circuit throug...

Methods for removing an edge polymer from a substrate

Apparatus and method for atomic layer deposition

Processes and systems for engineering a barrier surface for copper...

Methods of post-contact back end of line through-hole via integration

Apparatus for isolated bevel edge clean and method for using the same

Methods of fabricating electronic devices using direct copper plating

Methods and systems for low interfacial oxide contact between barri...

Interconnect structure and method of manufacturing a damascene stru...

Methods of fabricating a barrier layer with varying composition for...

Methods and systems for low interfacial oxide contact between barri...

Apparatus for the removal of a fluorinated polymer from a substrate...

Apparatus for the removal of a metal oxide from a substrate and met...

Apparatus for the removal of an edge polymer from a substrate and m...

Methods of post-contact back end of the line through-hole via integ...

Patents Applicationslast 30 patents

RESISTIVE RANDOM ACCESS MEMORY WITH PREFORMED FILAMENTS

MODIFYING FERROELECTRIC PROPERTIES OF HAFNIUM OXIDE WITH HAFNIUM NI...

CAPPING LAYER FOR A HAFNIUM OXIDE-BASED FERROELECTRIC MATERIAL

METHODS FOR IMPROVING PERFORMANCE IN HAFNIUM OXIDE-BASED FERROELECT...

Method of Surface Localized Pore Sealing of Porous Dielectric Material

Method of Sealing Open Pores on Surface of Porous Dielectric Materi...

METHODS FOR FORMING GERMANIUM AND SILICON GERMANIUM NANOWIRE DEVICES

Copper Interconnect Device Including Surface Functionalized Graphen...

SYSTEMS AND METHODS FOR FORMING SELECTIVE METAL ELECTRODE LAYERS FO...

Method of Manufacturing N-Doped Graphene and Electrical Component U...

METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...

METHODS FOR ATOMIC LAYER DEPOSITION

Processes and Systems for Engineering a Barrier Surface for Copper...

APPARATUS AND METHOD FOR ATOMIC LAYER DEPOSITION

DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

Methods for Isolated Bevel Edge Clean

METHODS OF FABRICATING ELECTRONIC DEVICES USING DIRECT COPPER PLATING

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...

INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURI...

Methods of Fabricating a Barrier Layer Over Interconnect Structures...

METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...

APPARATUS FOR THE REMOVAL OF A FLUORINATED POLYMER FROM A SUBSTRATE

METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE

METHODS FOR REMOVING AN EDGE POLYMER FROM A SUBSTRATE

METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

APPARATUS FOR INTEGRATED SURFACE TREATMENT AND DEPOSITION FOR COPPE...

Self assembled monolayer for improving adhesion between copper and...