Hyungu KANG

Person

Andong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,791,303
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling decoding process based on path metric value...
- Patent number 10,439,652
- Issue date Oct 8, 2019
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Convolutional decoder and method of decoding convolutional codes
- Patent number 10,382,061
- Issue date Aug 13, 2019
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Convolutional decoder and method of decoding convolutional codes
- Patent number 10,069,517
- Issue date Sep 4, 2018
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Interference signal control information acquisition method and appa...
- Patent number 9,503,215
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240250066
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK SEMICONDUCTOR PACKAGE
- Publication number 20240063155
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415852
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20220130793
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVOLUTIONAL DECODER AND METHOD OF DECODING CONVOLUTIONAL CODES
- Publication number 20180351580
- Publication date Dec 6, 2018
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR CONTROLLING DECODING PROCESS BASED ON PATH METRIC VALUE...
- Publication number 20180026662
- Publication date Jan 25, 2018
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONVOLUTIONAL DECODER AND METHOD OF DECODING CONVOLUTIONAL CODES
- Publication number 20180013447
- Publication date Jan 11, 2018
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERFERENCE SIGNAL CONTROL INFORMATION ACQUISITION METHOD AND APPA...
- Publication number 20150055591
- Publication date Feb 26, 2015
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Hyungu KANG

Person

Patents Grantslast 30 patents

Semiconductor package including semiconductor chips

Semiconductor package including semiconductor chips

Method for controlling decoding process based on path metric value...

Convolutional decoder and method of decoding convolutional codes

Convolutional decoder and method of decoding convolutional codes

Interference signal control information acquisition method and appa...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

STACK SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

CONVOLUTIONAL DECODER AND METHOD OF DECODING CONVOLUTIONAL CODES

METHOD FOR CONTROLLING DECODING PROCESS BASED ON PATH METRIC VALUE...

CONVOLUTIONAL DECODER AND METHOD OF DECODING CONVOLUTIONAL CODES

INTERFERENCE SIGNAL CONTROL INFORMATION ACQUISITION METHOD AND APPA...