Hyunguen IY

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Test socket and method for testing a semiconductor package
- Patent number 10,288,644
- Issue date May 14, 2019
- Samsung Electronics Co., Ltd.
- Hyunguen Iy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket pin and semiconductor package test system
- Patent number 9,979,150
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Soongeol Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST SOCKET AND METHOD FOR TESTING A SEMICONDUCTOR PACKAGE
- Publication number 20170176493
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Hyunguen IY
- G01 - MEASURING TESTING
Information Patent Application
SOCKET PIN AND SEMICONDUCTOR PACKAGE TEST SYSTEM
- Publication number 20170162991
- Publication date Jun 8, 2017
- Samsung Electronics Co., Ltd.
- Soongeol HWANG
- H01 - BASIC ELECTRIC ELEMENTS