Hyunil Bae

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Nonsan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming a fan-in package-on-pack...
- Patent number 9,559,046
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-in-package and met...
- Patent number 8,816,487
- Issue date Aug 26, 2014
- Stats Chippac Ltd.
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnects and...
- Patent number 8,476,135
- Issue date Jul 2, 2013
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Package with Double-Side...
- Publication number 20240063196
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...
- Publication number 20120299168
- Publication date Nov 29, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-In Package-on-Pack...
- Publication number 20100065948
- Publication date Mar 18, 2010
- STATS ChipPAC, Ltd.
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND MET...
- Publication number 20090236723
- Publication date Sep 24, 2009
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
- Publication number 20070268660
- Publication date Nov 22, 2007
- STATS ChipPAC Ltd.
- Seungyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS