Hyunjin LEE

Person

Hwasung-City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
3D printing apparatus and 3D printing method
- Patent number 12,070,903
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jungwoo Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate debonding apparatus
- Patent number 11,581,202
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling film thickness distribution and method of man...
- Patent number 9,931,838
- Issue date Apr 3, 2018
- Samsung Display Co., Ltd.
- Dongjun Lee
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250234506
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Donghyung Kim
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250220890
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- HEEJAE CHAE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250220894
- Publication date Jul 3, 2025
- Samsung Electronics Co., LTD
- SEUNGHOON KIM
Information Patent Application
HYBRID BONDING APPARATUS
- Publication number 20250201602
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...
- Publication number 20250180994
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juhyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES
- Publication number 20250176166
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hongjun Lee
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
- Publication number 20250140588
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250071969
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Yun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250016994
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Heejae CHAE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240431097
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Hyunjin Lee
Information Patent Application
3D PRINTING APPARATUS AND 3D PRINTING METHOD
- Publication number 20240367376
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Jungwoo Cho
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240341089
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Hosang LEE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290626
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Heejae CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240284662
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Heejae CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMI...
- Publication number 20240282604
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Sunwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTING APPARATUS AND 3D PRINTING METHOD
- Publication number 20230138834
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Jungwoo Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SUBSTRATE DEBONDING APPARATUS
- Publication number 20210358778
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING FILM THICKNESS DISTRIBUTION AND METHOD OF MAN...
- Publication number 20170266957
- Publication date Sep 21, 2017
- SAMSUNG DISPLAY CO., LTD.
- Dongjun LEE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Hyunjin LEE

Person

Patents Grantslast 30 patents

3D printing apparatus and 3D printing method

Substrate debonding apparatus

Method of controlling film thickness distribution and method of man...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MEMORY DEVICE

HYBRID BONDING APPARATUS

SELECTIVE PHOTORESIST APPLICATION METHOD AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR MEMORY DEVICES

DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

3D PRINTING APPARATUS AND 3D PRINTING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMI...

3D PRINTING APPARATUS AND 3D PRINTING METHOD

SUBSTRATE DEBONDING APPARATUS

METHOD OF CONTROLLING FILM THICKNESS DISTRIBUTION AND METHOD OF MAN...