Hyunjun Kim

Person

Chippewa Falls, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Skew compensation apparatus for controlling transmission line imped...
- Patent number 11,490,506
- Issue date Nov 1, 2022
- Hewlett Packard Enterprise Development LP
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric differential via stubs for skew compensation
- Patent number 11,343,905
- Issue date May 24, 2022
- Hewlett Packard Enterprise Development LP
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cross-talk reduction technique with fine pitch vias
- Patent number 10,966,311
- Issue date Mar 30, 2021
- Hewlett Packard Enterprise Development LP
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct connection of high speed signals on PCB chip
- Patent number 10,716,213
- Issue date Jul 14, 2020
- Hewlett Packard Enterprise Development LP
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB with minimized crosstalk
- Patent number 10,595,394
- Issue date Mar 17, 2020
- Cray Inc.
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for impedance compensation in printed circuit boards
- Patent number 10,154,581
- Issue date Dec 11, 2018
- Cray Inc.
- Andy Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with reduced cross-talk
- Patent number 8,885,357
- Issue date Nov 11, 2014
- Cray Inc.
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ASYMMETRIC DIFFERENTIAL VIA STUBS FOR SKEW COMPENSATION
- Publication number 20210274648
- Publication date Sep 2, 2021
- Cray Inc.
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKEW COMPENSATION APPARATUS FOR CONTROLLING TRANSMISSION LINE IMPED...
- Publication number 20200375025
- Publication date Nov 26, 2020
- Cray Inc.
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CROSS-TALK REDUCTION TECHNIQUE WITH FINE PITCH VIAS
- Publication number 20200375024
- Publication date Nov 26, 2020
- Cray Inc.
- HYUNJUN KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP
- Publication number 20200037448
- Publication date Jan 30, 2020
- Cray Inc.
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR IMPEDANCE COMPENSATION IN PRINTED CIRCUIT BOARDS
- Publication number 20180228019
- Publication date Aug 9, 2018
- Cray Inc.
- Andy Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
- Publication number 20160366759
- Publication date Dec 15, 2016
- Cray Inc.
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
- Publication number 20150013155
- Publication date Jan 15, 2015
- Cray Inc.
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
- Publication number 20130175077
- Publication date Jul 11, 2013
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hyunjun Kim

Person

Patents Grantslast 30 patents

Skew compensation apparatus for controlling transmission line imped...

Asymmetric differential via stubs for skew compensation

Method for cross-talk reduction technique with fine pitch vias

Direct connection of high speed signals on PCB chip

PCB with minimized crosstalk

Method for impedance compensation in printed circuit boards

Printed circuit board with reduced cross-talk

Patents Applicationslast 30 patents

ASYMMETRIC DIFFERENTIAL VIA STUBS FOR SKEW COMPENSATION

SKEW COMPENSATION APPARATUS FOR CONTROLLING TRANSMISSION LINE IMPED...

METHOD FOR CROSS-TALK REDUCTION TECHNIQUE WITH FINE PITCH VIAS

DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP

METHOD FOR IMPEDANCE COMPENSATION IN PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK

PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK

PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK