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Hyunjun Kim
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package with chip-side signal connections
Patent number
7,611,924
Issue date
Nov 3, 2009
Intel Corporation
Joong-Ho Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Transmission line impedance matching
Patent number
7,432,779
Issue date
Oct 7, 2008
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical capacitor apparatus, systems, and methods
Patent number
7,352,557
Issue date
Apr 1, 2008
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array capacitor apparatuses to filter input/output signal
Patent number
7,348,661
Issue date
Mar 25, 2008
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with chip-side signal connections
Patent number
7,345,359
Issue date
Mar 18, 2008
Intel Corporation
Joong-Ho Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flex tape architecture for integrated circuit signal ingress/egress
Patent number
7,321,167
Issue date
Jan 22, 2008
Intel Corporation
Dong Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transmission line impedance matching
Patent number
7,218,183
Issue date
May 15, 2007
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer inductor with shielding plane
Patent number
7,209,025
Issue date
Apr 24, 2007
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transmission line impedance matching
Patent number
7,142,073
Issue date
Nov 28, 2006
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Extended thin film capacitor (TFC)
Patent number
7,123,466
Issue date
Oct 17, 2006
Intel Corporation
Jiangqi He
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reference slots for signal traces
Patent number
7,110,263
Issue date
Sep 19, 2006
Intel Corporation
Jiangqi He
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Extended thin film capacitor (TFC)
Patent number
7,027,289
Issue date
Apr 11, 2006
Intel Corporation
Jiangqi He
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Vertical capacitor apparatus, systems, and methods
Patent number
6,885,544
Issue date
Apr 26, 2005
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power and ground connectors for socket
Patent number
6,877,998
Issue date
Apr 12, 2005
Intel Corporation
Hyunjun Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CHIP-SIDE SIGNAL CONNECTIONS
Publication number
20080131997
Publication date
Jun 5, 2008
Joong-Ho Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Transmission line impedance matching
Publication number
20070188262
Publication date
Aug 16, 2007
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transmission line impedance matching
Publication number
20060125574
Publication date
Jun 15, 2006
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Array capacitor apparatuses to filter input/output signal
Publication number
20060071341
Publication date
Apr 6, 2006
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transmission line impedance matching
Publication number
20050285695
Publication date
Dec 29, 2005
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Extended thin film capacitor (TFC)
Publication number
20050281008
Publication date
Dec 22, 2005
Intel Corporation
Jiangqi He
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EXTENDED THIN FILM CAPACITOR (TFC)
Publication number
20050213281
Publication date
Sep 29, 2005
Intel Corporation
Jiangqi He
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Reference slots for signal traces
Publication number
20050201072
Publication date
Sep 15, 2005
Jiangqi He
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated circuit package with chip-side signal connections
Publication number
20050194669
Publication date
Sep 8, 2005
Joong-Ho Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Vertical capacitor apparatus, systems, and methods
Publication number
20050164465
Publication date
Jul 28, 2005
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multilayer inductor with shielding plane
Publication number
20050128041
Publication date
Jun 16, 2005
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Differential signal traces coupled with high permittivity material
Publication number
20050087877
Publication date
Apr 28, 2005
Dong-Ho Han
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Floating trace on signal layer
Publication number
20050068751
Publication date
Mar 31, 2005
Hyunjun Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
VERTICAL CAPACITOR APPARATUS, SYSTEMS, AND METHODS
Publication number
20050063137
Publication date
Mar 24, 2005
Intel Corporation
Hyunjun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flex tape architecture for integrated circuit signal ingress/egress
Publication number
20040245610
Publication date
Dec 9, 2004
Dong Zhong
H01 - BASIC ELECTRIC ELEMENTS