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Hyunjun NOH

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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 11,824,043
    • Issue date Nov 21, 2023
    • Samsung Electronics Co, Ltd.
    • Hyunjun Noh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,626,380
    • Issue date Apr 11, 2023
    • Samsung Electronics Co., Ltd.
    • Hyunjun Noh
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240222324
    • Publication date Jul 4, 2024
    • Samsung Electronics Co., Ltd.
    • Hyunjun NOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGE
    • Publication number 20220037285
    • Publication date Feb 3, 2022
    • Samsung Electronics Co., Ltd.
    • Hyunjun NOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220020727
    • Publication date Jan 20, 2022
    • Samsung Electronics Co., Ltd.
    • Hyunjun NOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210407956
    • Publication date Dec 30, 2021
    • Samsung Electronics Co., Ltd.
    • Hyunjun NOH
    • H01 - BASIC ELECTRIC ELEMENTS