Hyunkyu Kim

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Yongin-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 12,062,605
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 11,658,107
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an embedded semiconductor device
- Patent number 11,404,382
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an in interposer and method of fabr...
- Patent number 11,367,679
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20220319973
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20210183757
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20210050297
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS