HYUNSU JUN

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SEONGNAM-SI, KR

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Patents Grantslast 30 patents

Information Patent Grant
Camera module and imaging apparatus including the same
- Patent number 11,949,975
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghak Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-input folded camera and mobile device including the same
- Patent number 11,914,271
- Issue date Feb 27, 2024
- Samsung Electronics Co., Ltd.
- Hyunjin Kang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Camera module and imaging apparatus including the same
- Patent number 11,563,874
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,482,554
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-input folded camera and mobile device including the same
- Patent number 11,392,012
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Hyunjin Kang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Sensor device
- Patent number 11,380,726
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and imaging apparatus including the same
- Patent number 11,252,308
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package
- Patent number 11,218,651
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- In-Sang Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light-folding camera and mobile device including the same
- Patent number 11,086,099
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Jihyung Lim
- G02 - OPTICS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 10,868,073
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,177,188
- Issue date Jan 8, 2019
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,008,533
- Issue date Jun 26, 2018
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for image sensor with outer and inner frames
- Patent number 9,966,401
- Issue date May 8, 2018
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including electrical insulation features
- Patent number 9,634,046
- Issue date Apr 25, 2017
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME
- Publication number 20220317550
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- Hyunjin KANG
- G02 - OPTICS
Information Patent Application
CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME
- Publication number 20220132011
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME
- Publication number 20220021794
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SENSOR DEVICE
- Publication number 20210134871
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME
- Publication number 20210116791
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- Hyunjin KANG
- G02 - OPTICS
Information Patent Application
LIGHT-FOLDING CAMERA AND MOBILE DEVICE INCLUDING THE SAME
- Publication number 20210048605
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- JIHYUNG LIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME
- Publication number 20200412922
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Seunghak LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20200366853
- Publication date Nov 19, 2020
- Samsung Electronics Co., Ltd.
- In-Sang SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200303445
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20190074316
- Publication date Mar 7, 2019
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180040658
- Publication date Feb 8, 2018
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170179182
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170154913
- Publication date Jun 1, 2017
- HYUNSU JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160260761
- Publication date Sep 8, 2016
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Manufacturing the Same
- Publication number 20160005778
- Publication date Jan 7, 2016
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL INSULATION FEATURES
- Publication number 20150325611
- Publication date Nov 12, 2015
- Samsung Electronics Co., Ltd.
- Hyunsu Jun
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Camera module and imaging apparatus including the same

Multi-input folded camera and mobile device including the same

Camera module and imaging apparatus including the same

Semiconductor package and method of fabricating the same

Multi-input folded camera and mobile device including the same

Sensor device

Camera module and imaging apparatus including the same

Image sensor package

Light-folding camera and mobile device including the same

Method of fabricating semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package

Package for image sensor with outer and inner frames

Semiconductor packages including electrical insulation features

Patents Applicationslast 30 patents

MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME

CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME

CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME

SENSOR DEVICE

MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME

LIGHT-FOLDING CAMERA AND MOBILE DEVICE INCLUDING THE SAME

CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME

IMAGE SENSOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Package and Method for Manufacturing the Same

SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL INSULATION FEATURES