Hyunsuk Chun

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal management of circuit boards
- Patent number 12,028,962
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with improved thermal p...
- Patent number 12,015,011
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of GPU-HBM package by microchannel integrated su...
- Patent number 11,915,997
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers including reinforcement structures and relate...
- Patent number 11,887,920
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,848,282
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,658
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with narrowed portions, and a...
- Patent number 11,676,932
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,616,028
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor device assemblies and systems with imp...
- Patent number 11,557,526
- Issue date Jan 17, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making double-sided semiconductor devices and related d...
- Patent number 11,538,762
- Issue date Dec 27, 2022
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for temperature modification and reduction of...
- Patent number 11,515,171
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Xiaopeng Qu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,444,037
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of circuit boards
- Patent number 11,419,239
- Issue date Aug 16, 2022
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders for use in semiconductor device testing, such as bur...
- Patent number 11,385,281
- Issue date Jul 12, 2022
- Micron Technology, Inc.
- Xiaopeng Qu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device assemblies and systems with improved thermal p...
- Patent number 11,211,364
- Issue date Dec 28, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step solder-mask-defined design
- Patent number 11,207,744
- Issue date Dec 28, 2021
- Micron Technology, Inc.
- Koustav Sinha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreaders for semiconductor devices, and associated systems an...
- Patent number 11,011,452
- Issue date May 18, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers including reinforcement structures and relate...
- Patent number 10,861,782
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 10,811,365
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 10,784,212
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kits for enhanced cooling of components of computing devices and re...
- Patent number 10,653,033
- Issue date May 12, 2020
- Micron Technology, Inc.
- Xiaopeng Qu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...
- Publication number 20240339437
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20240203827
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...
- Publication number 20230154823
- Publication date May 18, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20230086907
- Publication date Mar 23, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF CIRCUIT BOARDS
- Publication number 20220394878
- Publication date Dec 8, 2022
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...
- Publication number 20220122942
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP SOLDER-MASK-DEFINED DESIGN
- Publication number 20220111457
- Publication date Apr 14, 2022
- Micron Technology, Inc.
- Koustav Sinha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF CIRCUIT BOARDS
- Publication number 20210410278
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...
- Publication number 20210407882
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...
- Publication number 20210407964
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20210407889
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...
- Publication number 20210384042
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT MATERIALS FOR SEMICONDUCTOR DEVICES, AND ASSOCIA...
- Publication number 20210272872
- Publication date Sep 2, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING DOUBLE-SIDED SEMICONDUCTOR DEVICES AND RELATED D...
- Publication number 20210233851
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AN...
- Publication number 20210225733
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210202337
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH NARROWED PORTIONS, AND A...
- Publication number 20210202430
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP SOLDER-MASK-DEFINED DESIGN
- Publication number 20210121969
- Publication date Apr 29, 2021
- Micron Technology, Inc.
- Koustav Sinha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION LAYERS INCLUDING REINFORCEMENT STRUCTURES AND RELATE...
- Publication number 20210074623
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS FOR USE IN SEMICONDUCTOR DEVICE TESTING, SUCH AS BUR...
- Publication number 20210055343
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20210020585
- Publication date Jan 21, 2021
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200402925
- Publication date Dec 24, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200211983
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200211982
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AN...
- Publication number 20200176353
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KITS FOR ENHANCED COOLING OF COMPONENTS OF COMPUTING DEVICES AND RE...
- Publication number 20200137923
- Publication date Apr 30, 2020
- Micron Technology, Inc.
- Xiaopeng Qu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDISTRIBUTION LAYERS INCLUDING REINFORCEMENT STRUCTURES AND RELATE...
- Publication number 20200066625
- Publication date Feb 27, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190067145
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS

Hyunsuk Chun

Person

Patents Grantslast 30 patents

Thermal management of circuit boards

Semiconductor device assemblies and systems with improved thermal p...

Thermal management of GPU-HBM package by microchannel integrated su...

Redistribution layers including reinforcement structures and relate...

Semiconductor devices having crack-inhibiting structures

Semiconductor device

Semiconductor interconnect structures with narrowed portions, and a...

Semiconductor devices having crack-inhibiting structures

Substrates for semiconductor device assemblies and systems with imp...

Methods for making double-sided semiconductor devices and related d...

Methods and apparatus for temperature modification and reduction of...

Semiconductor devices having crack-inhibiting structures

Thermal management of circuit boards

Heat spreaders for use in semiconductor device testing, such as bur...

Semiconductor device assemblies and systems with improved thermal p...

Two-step solder-mask-defined design

Heat spreaders for semiconductor devices, and associated systems an...

Redistribution layers including reinforcement structures and relate...

Semiconductor devices having crack-inhibiting structures

Semiconductor devices having crack-inhibiting structures

Kits for enhanced cooling of components of computing devices and re...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

THERMAL MANAGEMENT OF CIRCUIT BOARDS

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...

TWO-STEP SOLDER-MASK-DEFINED DESIGN

THERMAL MANAGEMENT OF CIRCUIT BOARDS

SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMP...

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...

THERMAL MANAGEMENT MATERIALS FOR SEMICONDUCTOR DEVICES, AND ASSOCIA...

METHODS FOR MAKING DOUBLE-SIDED SEMICONDUCTOR DEVICES AND RELATED D...

HEAT SPREADERS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH NARROWED PORTIONS, AND A...

TWO-STEP SOLDER-MASK-DEFINED DESIGN

REDISTRIBUTION LAYERS INCLUDING REINFORCEMENT STRUCTURES AND RELATE...

HEAT SPREADERS FOR USE IN SEMICONDUCTOR DEVICE TESTING, SUCH AS BUR...

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

HEAT SPREADERS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AN...

KITS FOR ENHANCED COOLING OF COMPONENTS OF COMPUTING DEVICES AND RE...

REDISTRIBUTION LAYERS INCLUDING REINFORCEMENT STRUCTURES AND RELATE...

SEMICONDUCTOR DEVICE