Membership
Tour
Register
Log in
I-Hsin Mao
Follow
Person
Tainan County, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Structure of stacking chips and method for manufacturing the same
Patent number
8,809,088
Issue date
Aug 19, 2014
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
7,932,531
Issue date
Apr 26, 2011
ChipMOS Technologies Inc.
Chun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package
Patent number
7,642,137
Issue date
Jan 5, 2010
ChipMOS Technologies Inc.
Chun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and fabricating method thereof
Patent number
7,446,400
Issue date
Nov 4, 2008
ChipMOS Technologies, Inc.
Ya-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STRUCTURE OF STACKING CHIPS AND METHOD FOR MANUFACTURING THE SAME
Publication number
20130249042
Publication date
Sep 26, 2013
CHIPMOS TECHNOLOGIES INC.
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20090321918
Publication date
Dec 31, 2009
CHIPMOS TECHNOLOGIES INC.
Chun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20080157333
Publication date
Jul 3, 2008
CHIPMOS TECHNOLOGIES INC.
Chun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
Publication number
20080006917
Publication date
Jan 10, 2008
CHIPMOS TECHNOLOGIES INC.
Ya-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package and multi-layer lead frame utilized
Publication number
20070267756
Publication date
Nov 22, 2007
ChipMOS Technologies (Bermuda) Ltd.
I-Hsin Mao
H01 - BASIC ELECTRIC ELEMENTS