I-Hsuan PENG

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 12,142,598
- Issue date Nov 12, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,021,031
- Issue date Jun 25, 2024
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,948,895
- Issue date Apr 2, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,862,578
- Issue date Jan 2, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and fabrication method thereof
- Patent number 11,854,930
- Issue date Dec 26, 2023
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,830,820
- Issue date Nov 28, 2023
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,830,851
- Issue date Nov 28, 2023
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly having a conductive electromagnetic...
- Patent number 11,728,292
- Issue date Aug 15, 2023
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stiffener ring
- Patent number 11,728,232
- Issue date Aug 15, 2023
- Mediatek Inc.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid structure with opening and recess
- Patent number 11,688,655
- Issue date Jun 27, 2023
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,670,596
- Issue date Jun 6, 2023
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 11,646,295
- Issue date May 9, 2023
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 11,508,707
- Issue date Nov 22, 2022
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and fabrication method thereof
- Patent number 11,469,152
- Issue date Oct 11, 2022
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,410,936
- Issue date Aug 9, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stiffener ring
- Patent number 11,302,592
- Issue date Apr 12, 2022
- Mediatek Inc.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,264,337
- Issue date Mar 1, 2022
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,222,850
- Issue date Jan 11, 2022
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 11,171,113
- Issue date Nov 9, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid structure with opening and recess
- Patent number 10,957,611
- Issue date Mar 23, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,903,198
- Issue date Jan 26, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,784,211
- Issue date Sep 22, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked fan-out package structure
- Patent number 10,692,789
- Issue date Jun 23, 2020
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,497,689
- Issue date Dec 3, 2019
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for forming the same
- Patent number 10,483,211
- Issue date Nov 19, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly
- Patent number 10,468,341
- Issue date Nov 5, 2019
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,424,563
- Issue date Sep 24, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly
- Patent number 10,410,969
- Issue date Sep 10, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,256,210
- Issue date Apr 9, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240153887
- Publication date May 9, 2024
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20240055358
- Publication date Feb 15, 2024
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047427
- Publication date Feb 8, 2024
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...
- Publication number 20230197684
- Publication date Jun 22, 2023
- MEDIATEK INC.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE
- Publication number 20230044797
- Publication date Feb 9, 2023
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20230005808
- Publication date Jan 5, 2023
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220336374
- Publication date Oct 20, 2022
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STIFFENER RING
- Publication number 20220262691
- Publication date Aug 18, 2022
- MEDIA TEK INC.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220139848
- Publication date May 5, 2022
- MEDIATEK INC.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20220108954
- Publication date Apr 7, 2022
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...
- Publication number 20220020726
- Publication date Jan 20, 2022
- MEDIATEK INC.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210313271
- Publication date Oct 7, 2021
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210313299
- Publication date Oct 7, 2021
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS
- Publication number 20210175137
- Publication date Jun 10, 2021
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210159177
- Publication date May 27, 2021
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20210111090
- Publication date Apr 15, 2021
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE
- Publication number 20200365572
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20200365515
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200365526
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY HAVING A CONDUCTIVE ELECTROMAGNETIC...
- Publication number 20200168572
- Publication date May 28, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200105684
- Publication date Apr 2, 2020
- MEDIATEK INC.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20200075572
- Publication date Mar 5, 2020
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...
- Publication number 20200006289
- Publication date Jan 2, 2020
- MEDIATEK INC.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANTENNA PATTERN ELECTRICA...
- Publication number 20190252351
- Publication date Aug 15, 2019
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20190131233
- Publication date May 2, 2019
- MEDIATEK INC.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STIFFENER RING
- Publication number 20190115269
- Publication date Apr 18, 2019
- MEDIATEK INC.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20190043848
- Publication date Feb 7, 2019
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS
- Publication number 20190043771
- Publication date Feb 7, 2019
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FAN-OUT PACKAGE STRUCTURE
- Publication number 20180323127
- Publication date Nov 8, 2018
- MEDIATEK INC.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180269164
- Publication date Sep 20, 2018
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS

I-Hsuan PENG

Person

Patents Grantslast 30 patents

Semiconductor package with dummy MIM capacitor die

Semiconductor package structure having an annular frame with trunca...

Semiconductor package structure

Semiconductor package structure

Semiconductor package structure

Semiconductor chip package and fabrication method thereof

Electronic package with rotated semiconductor die

Semiconductor package structure

Semiconductor package assembly having a conductive electromagnetic...

Semiconductor package having a stiffener ring

Semiconductor package including lid structure with opening and recess

Semiconductor package structure

Semiconductor package structure having an annular frame with trunca...

Semiconductor package with dummy MIM capacitor die

Semiconductor chip package and fabrication method thereof

Semiconductor package structure

Semiconductor package having a stiffener ring

Semiconductor package structure

Electronic package with rotated semiconductor die

Semiconductor package structure having an annular frame with trunca...

Semiconductor package including lid structure with opening and recess

Semiconductor package assembly and method for forming the same

Semiconductor package structure

Stacked fan-out package structure

Semiconductor package assembly and method for forming the same

Fan-out package structure and method for forming the same

Semiconductor package assembly

Semiconductor package assembly and method for forming the same

Semiconductor package assembly

Semiconductor package structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...

SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE

SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING A STIFFENER RING

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE ASSEMBLY HAVING A CONDUCTIVE ELECTROMAGNETIC...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANTENNA PATTERN ELECTRICA...

SEMICONDUCTOR PACKAGE ASSEMBLY

SEMICONDUCTOR PACKAGE HAVING A STIFFENER RING

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS

STACKED FAN-OUT PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE