TREA

I. T. Liu

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  • Yuy-Ho City, TW
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Patents Applicationslast 30 patents

  • Information Patent Application

    Method for forming semiconductor ball grid array package
    • Publication number 20080274569
    • Publication date Nov 6, 2008
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Pei-Haw Tsao
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SEMICONDUCTOR BALL GRID ARRAY PACKAGE
    • Publication number 20080054455
    • Publication date Mar 6, 2008
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Pei-Haw Tsao
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...