Ian En Yoon Chin

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Betu Ferringhi, MY

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Patents Grantslast 30 patents

Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 12,009,318
- Issue date Jun 11, 2024
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 11,322,457
- Issue date May 3, 2022
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 10,658,307
- Issue date May 19, 2020
- Intel Corporation
- Digvijay A. Rorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 9,941,219
- Issue date Apr 10, 2018
- Intel Corporation
- Digvijay A. Rorane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20220230972
- Publication date Jul 21, 2022
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20200251426
- Publication date Aug 6, 2020
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20180301423
- Publication date Oct 18, 2018
- Intel Corporation
- DIGVIJAY A. RORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE
- Publication number 20160086894
- Publication date Mar 24, 2016
- Intel Corporation
- DIGVIJAY A. RORANE
- H01 - BASIC ELECTRIC ELEMENTS