Ian Harvey Arellano

Person

Bauang, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 11,862,579
- Issue date Jan 2, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 11,393,774
- Issue date Jul 19, 2022
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with wettable flanks
- Patent number 11,069,601
- Issue date Jul 20, 2021
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with backside protective layer during molding to prevent mo...
- Patent number 10,461,019
- Issue date Oct 29, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with backside protective layer during molding to prevent mo...
- Patent number 10,128,169
- Issue date Nov 13, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20240178006
- Publication date May 30, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSUL...
- Publication number 20240162168
- Publication date May 16, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH DE-METALLIZED POROUS STRUCTURES...
- Publication number 20230036201
- Publication date Feb 2, 2023
- STMICROELECTRONICS, INC.
- Ian Harvey Juralbal ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSUL...
- Publication number 20220320014
- Publication date Oct 6, 2022
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20210313255
- Publication date Oct 7, 2021
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSUL...
- Publication number 20210057355
- Publication date Feb 25, 2021
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20190267311
- Publication date Aug 29, 2019
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...
- Publication number 20190019745
- Publication date Jan 17, 2019
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...
- Publication number 20180331020
- Publication date Nov 15, 2018
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS

Ian Harvey Arellano

Person

Patents Grantslast 30 patents

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device having cavities at an interface of an encapsul...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device having cavities at an interface of an encapsul...

Semiconductor device having cavities at an interface of an encapsul...

Leadless semiconductor package with wettable flanks

Package with backside protective layer during molding to prevent mo...

Package with backside protective layer during molding to prevent mo...

Patents Applicationslast 30 patents

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSUL...

LEADLESS SEMICONDUCTOR PACKAGE WITH DE-METALLIZED POROUS STRUCTURES...

SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSUL...

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSUL...

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...

PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...