Ian HU

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heat transfer element, method for forming the same and semiconducto...
- Patent number 12,111,114
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Hung-Hsien Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,901,252
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures, methods for forming the same and semiconducto...
- Patent number 11,482,482
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,410,902
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and semiconductor device package and method for manufactu...
- Patent number 11,410,934
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement equipment and method for measuring warpage of a...
- Patent number 11,375,124
- Issue date Jun 28, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure and electronic device
- Patent number 11,282,767
- Issue date Mar 22, 2022
- ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,217,502
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-moldings fan-out package and process
- Patent number 11,152,274
- Issue date Oct 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and assembly structure
- Patent number 11,139,226
- Issue date Oct 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising heat pipe contacting a cover structure...
- Patent number 11,139,222
- Issue date Oct 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Jung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package structure
- Patent number 11,081,420
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having vapor chamber thermally conn...
- Patent number 11,024,557
- Issue date Jun 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,985,085
- Issue date Apr 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus and method for measuring warpage
- Patent number 10,861,726
- Issue date Dec 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun Hung Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 10,522,508
- Issue date Dec 31, 2019
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure, semiconductor device and method fo...
- Patent number 10,453,802
- Issue date Oct 22, 2019
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,410,942
- Issue date Sep 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240186201
- Publication date Jun 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220375809
- Publication date Nov 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER ELEMENT, METHOD FOR FORMING THE SAME AND SEMICONDUCTO...
- Publication number 20220243992
- Publication date Aug 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Hung-Hsien HUANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220093528
- Publication date Mar 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...
- Publication number 20220084926
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTU...
- Publication number 20210327815
- Publication date Oct 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265273
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PRO...
- Publication number 20210166987
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210134696
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210082782
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210013118
- Publication date Jan 14, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200365485
- Publication date Nov 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
OPTICAL MEASUREMENT EQUIPMENT AND METHOD FOR MEASURING WARPAGE OF A...
- Publication number 20200275030
- Publication date Aug 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20200266123
- Publication date Aug 20, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PRO...
- Publication number 20200161206
- Publication date May 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY STRUCTURE
- Publication number 20200111728
- Publication date Apr 9, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MEASURING WARPAGE
- Publication number 20200098605
- Publication date Mar 26, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun Hung TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200091036
- Publication date Mar 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200083143
- Publication date Mar 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Jung-Che TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20190341368
- Publication date Nov 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190164859
- Publication date May 30, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MOLDINGS FAN-OUT PACKAGE AND PROCESS
- Publication number 20190080975
- Publication date Mar 14, 2019
- Advanced Semiconductor Engineering, Inc.
- Wei-Hsuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD FO...
- Publication number 20190067207
- Publication date Feb 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180226320
- Publication date Aug 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Heat transfer element, method for forming the same and semiconducto...

Semiconductor device package and method of manufacturing the same

Substrate structures, methods for forming the same and semiconducto...

Semiconductor device package and method of manufacturing the same

Substrate and semiconductor device package and method for manufactu...

Optical measurement equipment and method for measuring warpage of a...

Semiconductor package structure and electronic device

Semiconductor device packages and methods of manufacturing the same

Multi-moldings fan-out package and process

Semiconductor package structure and assembly structure

Electronic device comprising heat pipe contacting a cover structure...

Substrate structure and semiconductor package structure

Semiconductor package

Semiconductor package structure having vapor chamber thermally conn...

Semiconductor device package and method for manufacturing the same

Apparatus and method for measuring warpage

Semiconductor device package and a method of manufacturing the same

Semiconductor package structure, semiconductor device and method fo...

Semiconductor device package and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

HEAT TRANSFER ELEMENT, METHOD FOR FORMING THE SAME AND SEMICONDUCTO...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...

SUBSTRATE AND SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTU...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PRO...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL MEASUREMENT EQUIPMENT AND METHOD FOR MEASURING WARPAGE OF A...

SEMICONDUCTOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PRO...

SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY STRUCTURE

APPARATUS AND METHOD FOR MEASURING WARPAGE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MULTI-MOLDINGS FAN-OUT PACKAGE AND PROCESS

SEMICONDUCTOR PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD FO...

SEMICONDUCTOR PACKAGE