Ian R. Johnston

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Ventura, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding material with embedded conductive particles
- Patent number 7,972,683
- Issue date Jul 5, 2011
- Innovative Micro Technology
- Christopher S. Gudeman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Wafer bonding material with embedded conductive particles
- Publication number 20070295456
- Publication date Dec 27, 2007
- Innovative Micro Technology
- Christopher S. Gudeman
- B81 - MICRO-STRUCTURAL TECHNOLOGY