Ibrahym Bin Ahmad

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Bukit Mertajam, MY

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Patents Grantslast 30 patents

Information Patent Grant
Solder paste stencil with aperture wall coating
- Patent number 12,069,810
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro solder joint and stencil aperture design
- Patent number 11,839,031
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
- Publication number 20240057261
- Publication date Feb 15, 2024
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
- Publication number 20230328892
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE STENCIL WITH APERTURE WALL COATING
- Publication number 20220159842
- Publication date May 19, 2022
- Western Digital Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR