Ichiro Anjo

Person

Koganei, JP

People

Patents Grantslast 30 patents

Information Patent Grant
BGA semiconductor device having a dummy bump
- Patent number 8,222,737
- Issue date Jul 17, 2012
- Elpida Memory, Inc.
- Yuji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BGA semiconductor device having a dummy bump
- Patent number 8,164,186
- Issue date Apr 24, 2012
- Elpida Memory, Inc.
- Yuji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with reduced length interconnect and manufact...
- Patent number 7,812,439
- Issue date Oct 12, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM stacked package, DIMM, and semiconductor manufacturing method
- Patent number 7,546,506
- Issue date Jun 9, 2009
- Hitachi, Ltd.
- Yuji Sonoda
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor storage device having a plurality of stacked memory c...
- Patent number 7,466,577
- Issue date Dec 16, 2008
- Hitachi, Ltd., Intellectual Property Group
- Tomonori Sekiguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,378,333
- Issue date May 27, 2008
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,119,428
- Issue date Oct 10, 2006
- Hitachi, Ltd.
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,057,283
- Issue date Jun 6, 2006
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having reduced substrate size and a metho...
- Patent number 6,989,600
- Issue date Jan 24, 2006
- Renesas Technology Corporation
- Masaharu Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device
- Patent number 6,949,416
- Issue date Sep 27, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,946,723
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of that
- Patent number 6,946,327
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,940,162
- Issue date Sep 6, 2005
- Renesas Technology Corp.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same and semi...
- Patent number 6,930,388
- Issue date Aug 16, 2005
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip size package having rerouting layers
- Patent number 6,861,742
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including insulating layer having a protrus...
- Patent number 6,822,317
- Issue date Nov 23, 2004
- Renesas Technology Corporation
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,784,541
- Issue date Aug 31, 2004
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 6,770,547
- Issue date Aug 3, 2004
- Renesas Technology Corporation
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 6,720,591
- Issue date Apr 13, 2004
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,639,323
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of mounting
- Patent number 6,627,997
- Issue date Sep 30, 2003
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,624,504
- Issue date Sep 23, 2003
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having stress cushioning layer
- Patent number 6,621,154
- Issue date Sep 16, 2003
- Hitachi, Ltd.
- Toshiya Satoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and mounting board
- Patent number 6,621,160
- Issue date Sep 16, 2003
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,563,212
- Issue date May 13, 2003
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,531,760
- Issue date Mar 11, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with elastic structure and wiring
- Patent number 6,515,371
- Issue date Feb 4, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof and mounting board
- Patent number 6,404,049
- Issue date Jun 11, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BGA SEMICONDUCTOR DEVICE HAVING A DUMMY BUMP
- Publication number 20100295179
- Publication date Nov 25, 2010
- Elpida Memory, Inc.
- Yuji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...
- Publication number 20090014874
- Publication date Jan 15, 2009
- Elpida Memory, Inc.
- Mitsuhisa WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM stacked package, DIMM, and semiconductor manufacturing method
- Publication number 20060239055
- Publication date Oct 26, 2006
- Yuji Sonoda
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor storage device having a plurality of stacked memory c...
- Publication number 20060233012
- Publication date Oct 19, 2006
- ELPIDA MEMORY, INC.
- Tomonori Sekiguchi
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050245061
- Publication date Nov 3, 2005
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA semiconductor device having a dummy bump
- Publication number 20050230824
- Publication date Oct 20, 2005
- ELPIDA MEMORY, INC.
- Yuji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20040251540
- Publication date Dec 16, 2004
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20040227254
- Publication date Nov 18, 2004
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20040195687
- Publication date Oct 7, 2004
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of that
- Publication number 20040155351
- Publication date Aug 12, 2004
- RENESAS TECHNOLOGY CORPORATION
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207557
- Publication date Nov 6, 2003
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit and method of manufacturing thereof
- Publication number 20030148558
- Publication date Aug 7, 2003
- Masaharu Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20030071348
- Publication date Apr 17, 2003
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20020153539
- Publication date Oct 24, 2002
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and mounting board
- Publication number 20020105070
- Publication date Aug 8, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of that
- Publication number 20020093082
- Publication date Jul 18, 2002
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and mounting board
- Publication number 20020066955
- Publication date Jun 6, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same and semi...
- Publication number 20020063332
- Publication date May 30, 2002
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020050636
- Publication date May 2, 2002
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020047215
- Publication date Apr 25, 2002
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020025655
- Publication date Feb 28, 2002
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20010008302
- Publication date Jul 19, 2001
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Ichiro Anjo

Person

Patents Grantslast 30 patents

BGA semiconductor device having a dummy bump

BGA semiconductor device having a dummy bump

Semiconductor package with reduced length interconnect and manufact...

DRAM stacked package, DIMM, and semiconductor manufacturing method

Semiconductor storage device having a plurality of stacked memory c...

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device and method for producing the same

Integrated circuit device having reduced substrate size and a metho...

Method of manufacturing a semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of that

Semiconductor module and mounting method for same

Semiconductor device and method for manufacturing the same and semi...

Semiconductor device

Wafer level chip size package having rerouting layers

Semiconductor apparatus including insulating layer having a protrus...

Semiconductor module and mounting method for same

Method for producing a semiconductor device

Semiconductor device

Semiconductor integrated circuit device

Semiconductor device and its manufacturing method

Semiconductor module and method of mounting

Semiconductor device and method for manufacturing the same

Semiconductor apparatus having stress cushioning layer

Semiconductor device and mounting board

Semiconductor device

Semiconductor device

Semiconductor device with elastic structure and wiring

Semiconductor device, manufacturing method thereof and mounting board

Patents Applicationslast 30 patents

BGA SEMICONDUCTOR DEVICE HAVING A DUMMY BUMP

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...

DRAM stacked package, DIMM, and semiconductor manufacturing method

Semiconductor storage device having a plurality of stacked memory c...

Semiconductor device and manufacturing method thereof

BGA semiconductor device having a dummy bump

Semiconductor module and mounting method for same

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor device and method for producing the same

Semiconductor device and manufacturing method of that

Semiconductor device

Semiconductor device and its manufacturing method

Integrated circuit and method of manufacturing thereof

Semiconductor device

Semiconductor module and mounting method for same

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor device, manufacturing method thereof and mounting board

Semiconductor device and manufacturing method of that

Semiconductor device, manufacturing method thereof and mounting board

Semiconductor device and method for manufacturing the same and semi...

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method thereof

Semiconductor device