Ichiro Hayashi

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Itami, JP

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Patents Grantslast 30 patents

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Apparatus for producing semiconductor device
- Patent number 5,332,406
- Issue date Jul 26, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Toshio Takeuchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of dividing semiconductor wafer using ultraviolet sensitive...
- Patent number 5,238,876
- Issue date Aug 24, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Toshio Takeuchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer breaking apparatus
- Patent number 4,775,085
- Issue date Oct 4, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Ishizuka
- B28 - WORKING CEMENT, CLAY, OR STONE