Ichiro Hazeyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Support for manufacturing semiconductor packages, use of support fo...
- Patent number 10,896,827
- Issue date Jan 19, 2021
- Zeon Corporation
- Ichiro Hazeyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for manufacturing the same, circuit...
- Patent number 7,594,644
- Issue date Sep 29, 2009
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component unit
- Patent number 7,352,069
- Issue date Apr 1, 2008
- Nitto Denko Corporation
- Ichiro Hazeyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor package and laminated semiconductor package
- Patent number 7,230,328
- Issue date Jun 12, 2007
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of arranging microspheres with liquid, microsphere arranging...
- Patent number 7,119,438
- Issue date Oct 10, 2006
- NEC Corporation
- Ichiro Hazeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same, circuit...
- Patent number 6,998,704
- Issue date Feb 14, 2006
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer apparatus for arraying small conductive bumps on a substra...
- Patent number 6,926,188
- Issue date Aug 9, 2005
- NEC Corporation
- Ichiro Hazeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer apparatus for arraying small conductive bumps on substrate...
- Patent number 6,889,886
- Issue date May 10, 2005
- NEC Corporation
- Ichiro Hazeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 6,674,016
- Issue date Jan 6, 2004
- Nitto Denko Corporation
- Masahiro Kubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low-temperature calcined glass ceramic and a manufacturing process...
- Patent number 6,348,424
- Issue date Feb 19, 2002
- NEC Corporation
- Ichiro Hazeyama
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Low temperature firing glass-ceramic substrate and production proce...
- Patent number 5,902,758
- Issue date May 11, 1999
- NEC Corporation
- Ichiro Hazeyama
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multi-layer wiring substrate, and process for producing the same
- Patent number 5,728,470
- Issue date Mar 17, 1998
- NEC Corporation
- Ichiro Hazeyama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for producing a silica sintered product for a multi-layer w...
- Patent number 5,714,112
- Issue date Feb 3, 1998
- NEC Corporation
- Ichiro Hazeyama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
SHAPED ARTICLE AND METHOD OF MANUFACTURING THE SAME, PREPREG, AND L...
- Publication number 20210246284
- Publication date Aug 12, 2021
- ZEON CORPORATION
- Ichiro HAZEYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SUPPORT FOR MANUFACTURING SEMICONDUCTOR PACKAGES, USE OF SUPPORT FO...
- Publication number 20190148175
- Publication date May 16, 2019
- ZEON CORPORATION
- Ichiro HAZEYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Electronic component unit
- Publication number 20060103028
- Publication date May 18, 2006
- Nitto Denko Corporation
- Ichiro Hazeyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing the same, circuit...
- Publication number 20060055053
- Publication date Mar 16, 2006
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and laminated semiconductor package
- Publication number 20060049495
- Publication date Mar 9, 2006
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of arranging micro spheres with liquid, micro sphere arrangi...
- Publication number 20050040528
- Publication date Feb 24, 2005
- Ichiro Hazeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same, circuit...
- Publication number 20040115920
- Publication date Jun 17, 2004
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer apparatus for arraying small conductive bumps on substrate...
- Publication number 20040094601
- Publication date May 20, 2004
- Ichiro Hazeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component
- Publication number 20030116347
- Publication date Jun 26, 2003
- NITTO DENKO CORPORATION
- Masahiro Kubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Transfer apparatus for arraying small conductive bumps on substrate...
- Publication number 20020135064
- Publication date Sep 26, 2002
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS

Ichiro Hazeyama

Person

Patents Grantslast 30 patents

Support for manufacturing semiconductor packages, use of support fo...

Semiconductor device and method for manufacturing the same, circuit...

Electronic component unit

Semiconductor package and laminated semiconductor package

Method of arranging microspheres with liquid, microsphere arranging...

Semiconductor device and method for manufacturing the same, circuit...

Transfer apparatus for arraying small conductive bumps on a substra...

Transfer apparatus for arraying small conductive bumps on substrate...

Electronic component

Low-temperature calcined glass ceramic and a manufacturing process...

Low temperature firing glass-ceramic substrate and production proce...

Multi-layer wiring substrate, and process for producing the same

Process for producing a silica sintered product for a multi-layer w...

Patents Applicationslast 30 patents

SHAPED ARTICLE AND METHOD OF MANUFACTURING THE SAME, PREPREG, AND L...

SUPPORT FOR MANUFACTURING SEMICONDUCTOR PACKAGES, USE OF SUPPORT FO...

Electronic component unit

Semiconductor device and method for manufacturing the same, circuit...

Semiconductor package and laminated semiconductor package

Method of arranging micro spheres with liquid, micro sphere arrangi...

Semiconductor device and method for manufacturing the same, circuit...

Transfer apparatus for arraying small conductive bumps on substrate...

Electronic component

Transfer apparatus for arraying small conductive bumps on substrate...