Ichiro Katakabe

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Yokohama, JP

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Patents Grantslast 30 patents

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Method of manufacturing a semiconductor device having an element is...
- Patent number 5,943,578
- Issue date Aug 24, 1999
- Kabushiki Kaisha Toshiba
- Ichiro Katakabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing a semiconductor device
- Patent number 5,880,032
- Issue date Mar 9, 1999
- Kabushiki Kaisha Toshiba
- Kenji Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment apparatus for semiconductor wafers
- Patent number 5,878,191
- Issue date Mar 2, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and apparatus for detecting a polishing end point...
- Patent number 5,643,046
- Issue date Jul 1, 1997
- Kabushiki Kaisha Toshiba
- Ichiro Katakabe
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus of semiconductor wafer
- Patent number 5,605,488
- Issue date Feb 25, 1997
- Kabushiki Kaisha Toshiba
- Hiroyuki Ohashi
- B24 - GRINDING POLISHING