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Ichiro Okumura
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Kyoto, JP
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last 30 patents
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Patent Grant
Plastic encapsulated semiconductor device and method of manufacturi...
Patent number
6,130,115
Issue date
Oct 10, 2000
Matsushita Electronics Corporation
Ichiro Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic encapsulated semiconductor device and method of manufacturi...
Patent number
5,942,794
Issue date
Aug 24, 1999
Matsushita Electronics Corporation
Ichiro Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and method of mounting semiconductor chip
Patent number
5,708,293
Issue date
Jan 13, 1998
Matsushita Electronics Corporation
Takao Ochi
H01 - BASIC ELECTRIC ELEMENTS