Ichiro Yamaguchi

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of solder balls having resin member as reinforcement
- Patent number 6,897,142
- Issue date May 24, 2005
- Fujitsu Limited
- Joji Fujimori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making semiconductor device
- Patent number 6,689,639
- Issue date Feb 10, 2004
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,528,346
- Issue date Mar 4, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder bumps
- Patent number 6,319,810
- Issue date Nov 20, 2001
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,271,110
- Issue date Aug 7, 2001
- Fujitsu Limited
- Ichiro Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating bump forming plate member
- Patent number 6,090,301
- Issue date Jul 18, 2000
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating solder bumps by forming solder balls with a...
- Patent number 6,025,258
- Issue date Feb 15, 2000
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor device, base member for semico...
- Patent number 6,022,759
- Issue date Feb 8, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the device
- Patent number 5,920,117
- Issue date Jul 6, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a packaged semiconductor having a divided...
- Patent number 5,804,468
- Issue date Sep 8, 1998
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, base member for semiconductor device and semi...
- Patent number 5,747,874
- Issue date May 5, 1998
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming solder balls on a plate having apertures using...
- Patent number 5,643,831
- Issue date Jul 1, 1997
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and lead frame therefore
- Patent number 5,497,032
- Issue date Mar 5, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ceramic package
- Patent number 5,091,770
- Issue date Feb 25, 1992
- Fujitsu Limited
- Ichiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Formation of solder balls having resin member as reinforcement
- Publication number 20040046252
- Publication date Mar 11, 2004
- FUJITSU LIMITED
- Joji Fujimori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making semiconductor device
- Publication number 20030096494
- Publication date May 22, 2003
- FUJITSU LIMITED
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-forming method using two plates and electronic device
- Publication number 20010018263
- Publication date Aug 30, 2001
- Masayuki Ochiai
- H01 - BASIC ELECTRIC ELEMENTS

Ichiro Yamaguchi

Person

Patents Grantslast 30 patents

Formation of solder balls having resin member as reinforcement

Method of making semiconductor device

Bump-forming method using two plates and electronic device

Method for forming solder bumps

Bump-forming method using two plates and electronic device

Method for fabricating bump forming plate member

Method for fabricating solder bumps by forming solder balls with a...

Method for producing a semiconductor device, base member for semico...

Semiconductor device and method of forming the device

Process for manufacturing a packaged semiconductor having a divided...

Semiconductor device, base member for semiconductor device and semi...

Process for forming solder balls on a plate having apertures using...

Semiconductor device and lead frame therefore

Semiconductor device having a ceramic package

Patents Applicationslast 30 patents

Formation of solder balls having resin member as reinforcement

Method of making semiconductor device

Bump-forming method using two plates and electronic device