Ichiro Yamahata

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Inclination adjusting mechanism
- Patent number 11,794,295
- Issue date Oct 24, 2023
- Disco Corporation
- Ichiro Yamahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece processing and resin grinding apparatus
- Patent number 11,574,804
- Issue date Feb 7, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wafer processing method
- Patent number 11,056,346
- Issue date Jul 6, 2021
- Disco Corporation
- Hideyuki Sandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing machine
- Patent number 7,022,000
- Issue date Apr 4, 2006
- Disco Corporation
- Yasutaka Mizomoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
INCLINATION ADJUSTING MECHANISM
- Publication number 20210229228
- Publication date Jul 29, 2021
- Disco Corporation
- Ichiro YAMAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210057225
- Publication date Feb 25, 2021
- Disco Corporation
- Hideyuki SANDOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS
- Publication number 20190206673
- Publication date Jul 4, 2019
- Disco Corporation
- Shinya WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE PROCESSING APPARATUS
- Publication number 20190198357
- Publication date Jun 27, 2019
- Disco Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing machine
- Publication number 20050118938
- Publication date Jun 2, 2005
- Yasutaka Mizomoto
- B24 - GRINDING POLISHING