Ichiro Yoshimura

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Utsunomiya City, JP

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Patents Grantslast 30 patents

Information Patent Grant
Methods for reducing the width of the unbonded region in SOI struct...
- Patent number 8,440,541
- Issue date May 14, 2013
- MEMC Electronic Materials, Inc.
- John A. Pitney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers with reduced roll-off and bonded and unbonded...
- Patent number 8,330,245
- Issue date Dec 11, 2012
- MEMC Electronic Materials, Inc.
- John A. Pitney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for storing carrier for polishing wafer
- Patent number 6,379,226
- Issue date Apr 30, 2002
- MEMC Electronic Materials, Inc.
- Masaaki Ikeda
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFERS WITH REDUCED ROLL-OFF AND BONDED AND UNBONDED...
- Publication number 20110204471
- Publication date Aug 25, 2011
- MEMC Electronic Materials, Inc.
- John A. Pitney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING THE WIDTH OF THE UNBONDED REGION IN SOI STRUCT...
- Publication number 20110207246
- Publication date Aug 25, 2011
- MEMC Electronic Materials, Inc.
- John A. Pitney
- H01 - BASIC ELECTRIC ELEMENTS