Ido Almog

Person

Rehovot, IL

People

Patents Grantslast 30 patents

Information Patent Grant
Depth profiling of semiconductor structures using picosecond ultras...
- Patent number 11,859,963
- Issue date Jan 2, 2024
- Applied Materials Israel Ltd.
- Ori Golani
- G01 - MEASURING TESTING
Information Patent Grant
Multi-perspective wafer analysis
- Patent number 11,815,470
- Issue date Nov 14, 2023
- Applied Materials Israel, Ltd.
- Haim Feldman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die-to-multi-die wafer inspection
- Patent number 11,803,961
- Issue date Oct 31, 2023
- Applied Materials Israel Ltd.
- Ron Naftali
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cathodoluminescence focal scans to characterize 3D NAND CH profile
- Patent number 11,713,964
- Issue date Aug 1, 2023
- Applied Materials Israel Ltd.
- David Goldovsky
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for analysis of wafer scan data
- Patent number 11,688,055
- Issue date Jun 27, 2023
- Applied Materials Israel Ltd.
- Guy Shwartz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional surface metrology of wafers
- Patent number 11,662,324
- Issue date May 30, 2023
- Applied Materials Israel Ltd.
- Ido Almog
- G01 - MEASURING TESTING
Information Patent Grant
Depth profiling of semiconductor structures using picosecond ultras...
- Patent number 11,519,720
- Issue date Dec 6, 2022
- Applied Materials Israel Ltd.
- Ori Golani
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for expediting multi-perspective wafer analysis
- Patent number 11,250,560
- Issue date Feb 15, 2022
- Applied Materials Israel Ltd.
- Doron Korngut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-perspective wafer analysis using an acousto-optic deflector
- Patent number 11,195,267
- Issue date Dec 7, 2021
- Applied Materials Israel Ltd.
- Harel Ilan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-perspective examination of a specimen
- Patent number 11,035,803
- Issue date Jun 15, 2021
- Applied Materials Israel Ltd.
- Ido Almog
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computerized system and method for obtaining information about a re...
- Patent number 10,902,582
- Issue date Jan 26, 2021
- Applied Materials Israel, Ltd.
- Haim Feldman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for inspecting an object with an array of beams
- Patent number 9,784,689
- Issue date Oct 10, 2017
- Applied Materials Israel Ltd.
- Ido Almog
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for inspecting an object
- Patent number 9,535,014
- Issue date Jan 3, 2017
- Applied Materials Israel Ltd.
- Haim Feldman
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID SCANNING ELECTRON MICROSCOPY AND ACOUSTO-OPTIC BASED METROLOGY
- Publication number 20230326713
- Publication date Oct 12, 2023
- APPLIED MATERIALS ISRAEL LTD.
- Guy Shwartz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODOLUMINESCENCE FOCAL SCANS TO CHARACTERIZE 3D NAND CH PROFILE
- Publication number 20230221112
- Publication date Jul 13, 2023
- APPLIED MATERIALS ISRAEL LTD.
- David Goldovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-MULTI-DIE WAFER INSPECTION
- Publication number 20230107630
- Publication date Apr 6, 2023
- APPLIED MATERIALS ISRAEL LTD.
- Ron Naftali
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEPTH PROFILING OF SEMICONDUCTOR STRUCTURES USING PICOSECOND ULTRAS...
- Publication number 20230040995
- Publication date Feb 9, 2023
- APPLIED MATERIALS ISRAEL LTD.
- Ori Golani
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR ANALYSIS OF WAFER SCAN DATA
- Publication number 20220237758
- Publication date Jul 28, 2022
- APPLIED MATERIALS ISRAEL LTD.
- Guy SHWARTZ
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEPTH PROFILING OF SEMICONDUCTOR STRUCTURES USING PICOSECOND ULTRAS...
- Publication number 20220113129
- Publication date Apr 14, 2022
- APPLIED MATERIALS ISRAEL, LTD.
- Ori GOLANI
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR EXPEDITING MULTI-PERSPECTIVE WAFER ANALYSIS
- Publication number 20220012862
- Publication date Jan 13, 2022
- APPLIED MATERIALS ISRAEL LTD.
- Doron Korngut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-PERSPECTIVE WAFER ANALYSIS
- Publication number 20200400589
- Publication date Dec 24, 2020
- Applied Materials Israel, Ltd.
- Haim FELDMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTERIZED SYSTEM AND METHOD FOR OBTAINING INFORMATION ABOUT A RE...
- Publication number 20200234418
- Publication date Jul 23, 2020
- Applied Materials Israel, Ltd.
- Haim FELDMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-PERSPECTIVE WAFER ANALYSIS
- Publication number 20200232934
- Publication date Jul 23, 2020
- APPLIED MATERIALS ISRAEL, LTD.
- Haim FELDMAN
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR INSPECTING AN OBJECT
- Publication number 20170016834
- Publication date Jan 19, 2017
- APPLIED MATERIALS ISRAEL, LTD.
- Haim Feldman
- G02 - OPTICS
Information Patent Application
METHOD FOR INSPECTING AN OBJECT WITH AN ARRAY OF BEAMS
- Publication number 20170010219
- Publication date Jan 12, 2017
- APPLIED MATERIALS ISRAEL LTD.
- Ido Almog
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Depth profiling of semiconductor structures using picosecond ultras...

Multi-perspective wafer analysis

Die-to-multi-die wafer inspection

Cathodoluminescence focal scans to characterize 3D NAND CH profile

Methods and systems for analysis of wafer scan data

Three-dimensional surface metrology of wafers

Depth profiling of semiconductor structures using picosecond ultras...

Methods and systems for expediting multi-perspective wafer analysis

Multi-perspective wafer analysis using an acousto-optic deflector

Multi-perspective examination of a specimen

Computerized system and method for obtaining information about a re...

Method and system for inspecting an object with an array of beams

Systems and methods for inspecting an object

Patents Applicationslast 30 patents

HYBRID SCANNING ELECTRON MICROSCOPY AND ACOUSTO-OPTIC BASED METROLOGY

CATHODOLUMINESCENCE FOCAL SCANS TO CHARACTERIZE 3D NAND CH PROFILE

DIE-TO-MULTI-DIE WAFER INSPECTION

DEPTH PROFILING OF SEMICONDUCTOR STRUCTURES USING PICOSECOND ULTRAS...

METHODS AND SYSTEMS FOR ANALYSIS OF WAFER SCAN DATA

DEPTH PROFILING OF SEMICONDUCTOR STRUCTURES USING PICOSECOND ULTRAS...

METHODS AND SYSTEMS FOR EXPEDITING MULTI-PERSPECTIVE WAFER ANALYSIS

MULTI-PERSPECTIVE WAFER ANALYSIS

COMPUTERIZED SYSTEM AND METHOD FOR OBTAINING INFORMATION ABOUT A RE...

MULTI-PERSPECTIVE WAFER ANALYSIS

SYSTEMS AND METHODS FOR INSPECTING AN OBJECT

METHOD FOR INSPECTING AN OBJECT WITH AN ARRAY OF BEAMS