Igor Zavarine

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New Haven, CT, US

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Patents Grantslast 30 patents

Information Patent Grant
Tin-silver solder bumping in electronics manufacture
- Patent number 7,713,859
- Issue date May 11, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating solution for high speed plating of tin-copper solder
- Patent number 6,808,614
- Issue date Oct 26, 2004
- Lucent Technologies Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating solution for high speed plating of tin-bismuth solder
- Patent number 6,726,827
- Issue date Apr 27, 2004
- Lucent Technologies Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
- Publication number 20070037377
- Publication date Feb 15, 2007
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Corrosion resistance enhancement of tin surfaces
- Publication number 20050268991
- Publication date Dec 8, 2005
- Enthone Inc.
- Chonglun Fan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroplating solution for high speed plating of tin-copper solder
- Publication number 20030131753
- Publication date Jul 17, 2003
- TECHNOLOGIES INC.
- Oscar Khaselev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating solution for high speed plating of tin-bismuth solder
- Publication number 20030132122
- Publication date Jul 17, 2003
- LUCENT TECHNOLOGIES INC.
- Oscar Khaselev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR