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II Kwon Shim
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
Patent number
9,449,943
Issue date
Sep 20, 2016
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with exposed interconnects
Patent number
8,704,349
Issue date
Apr 22, 2014
Stats Chippac Ltd.
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system for package stacking and manufact...
Patent number
8,067,272
Issue date
Nov 29, 2011
Stats Chippac Ltd.
Young Cheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interconnect structure f...
Patent number
8,004,095
Issue date
Aug 23, 2011
STATS ChipPAC, Ltd.
II Kwon Shim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package system with substrate having different bondab...
Patent number
7,986,032
Issue date
Jul 26, 2011
Stats Chippac Ltd.
Seng Guan Chow
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Compliant Stress Relief...
Publication number
20150145126
Publication date
May 28, 2015
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Interconnect Structure f...
Publication number
20120286422
Publication date
Nov 15, 2012
STATS ChipPAC, Ltd.
II Kwon Shim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR