Iji Onozuka

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Laminated body, circuit board including laminated body, semiconduct...
- Patent number 8,871,660
- Issue date Oct 28, 2014
- Sumitomo Bakelite Co., Ltd.
- Kazuyuki Yoshizaki
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
INSULATING SUBSTRATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND...
- Publication number 20130242520
- Publication date Sep 19, 2013
- SUMITOMO BAKELITE CO., LTD.
- Iji Onozuka
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, C...
- Publication number 20110308848
- Publication date Dec 22, 2011
- Sumitomo Bakelite Company, Ltd.
- Yuka Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCT...
- Publication number 20100078201
- Publication date Apr 1, 2010
- SUMITOMO BAKELITE CO., LTD.
- Kazuyuki Yoshizaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Insulating Resin Layer, Insulating Resin Layer With Carrier And Mul...
- Publication number 20090166060
- Publication date Jul 2, 2009
- Iji Onozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer circuit board and method for manufacturing same
- Publication number 20040148766
- Publication date Aug 5, 2004
- Jinichi Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR