Ikemoto Yoshihiko

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and circuit board
- Patent number 8,811,028
- Issue date Aug 19, 2014
- Fujitsu Semiconductor Limited
- Yoshihiko Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device substrate and semiconductor device
- Patent number 8,659,120
- Issue date Feb 25, 2014
- Fujitsu Semiconductor Limited
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and a semiconductor device
- Patent number 7,309,917
- Issue date Dec 18, 2007
- Fujitsu Limited
- Yoshiyuki Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and a semiconductor device
- Patent number 7,030,480
- Issue date Apr 18, 2006
- Fujitsu Limited
- Yoshiyuki Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making semiconductor device
- Patent number 6,796,024
- Issue date Sep 28, 2004
- Fujitsu Limited
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate having differential signal wires and a...
- Patent number 6,573,600
- Issue date Jun 3, 2003
- Fujitsu Limited
- Atsushi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a heat spreading plate
- Patent number 6,559,536
- Issue date May 6, 2003
- Fujitsu Limited
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a power supply ring and a ground ring
- Patent number 6,424,032
- Issue date Jul 23, 2002
- Fujitsu Limited
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package with equal length transmission Lines
- Patent number 6,235,997
- Issue date May 22, 2001
- Fujitsu Limited
- Kenji Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a packaged semiconductor having a divided...
- Patent number 5,804,468
- Issue date Sep 8, 1998
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefore
- Patent number 5,497,032
- Issue date Mar 5, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20120098091
- Publication date Apr 26, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT BOARD
- Publication number 20110157852
- Publication date Jun 30, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Yoshihiko Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer board and a semiconductor device
- Publication number 20060145330
- Publication date Jul 6, 2006
- FUJITSU LIMITED
- Kimura Yoshiyuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer board and a semiconductor device
- Publication number 20040041277
- Publication date Mar 4, 2004
- FUJITSU LIMITED
- Yoshiyuki Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20030161112
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring substrate having differential signal wires and a...
- Publication number 20020060366
- Publication date May 23, 2002
- Atsushi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS

Ikemoto Yoshihiko

Person

Patents Grantslast 30 patents

Semiconductor device and circuit board

Semiconductor device substrate and semiconductor device

Multilayer board and a semiconductor device

Multilayer board and a semiconductor device

Method for making semiconductor device

Multilayer wiring substrate having differential signal wires and a...

Semiconductor device having a heat spreading plate

Semiconductor device having a power supply ring and a ground ring

LSI package with equal length transmission Lines

Process for manufacturing a packaged semiconductor having a divided...

Semiconductor device and lead frame therefore

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND CIRCUIT BOARD

Multilayer board and a semiconductor device

Multilayer board and a semiconductor device

Semiconductor device and method of producing the same

Multilayer wiring substrate having differential signal wires and a...